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SI7909DN PDF预览

SI7909DN

更新时间: 2024-09-14 21:54:55
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
5页 186K
描述
Dual P-Channel 12-V (D-S) MOSFET

SI7909DN 数据手册

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Si7909DN  
Vishay Siliconix  
New Product  
Dual P-Channel 12-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFETS: 1.8-V Rated  
VDS (V)  
rDS(on) ()  
ID (A)  
–7.7  
–6.8  
–5.7  
New Low Thermal Resistance PowerPAK®  
Package  
Pb-free  
Available  
0.037 @ VGS = –4.5 V  
0.048 @ VGS = –2.5 V  
0.068 @ VGS = –1.8 V  
Advanced High Cell Density Process  
Ultra-Low rDS(on), and High PD Capability  
RoHS*  
–12  
COMPLIANT  
APPLICATIONS  
Load Switch  
PA Switch  
Battery Switch  
Bi-Directional Switch  
PowerPAK 1212-8  
S
1
S
2
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
G
G
1
2
D1  
8
D1  
7
D2  
6
D2  
5
D
2
D
1
Bottom View  
P-Channel MOSFET  
P-Channel MOSFET  
Ordering Information: Si7909DN-T1  
Si7909DN–T1–E3 (Lead (Pb)–free)  
ABSOLUTE MAXIMUM RATINGS T = 25°C, unless otherwise noted  
A
Parameter  
Symbol  
10 secs  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
–12  
8
V
VGS  
TA = 25°C  
–7.7  
–5.5  
–5.3  
–3.8  
Continuous Drain Current (TJ = 150°C)a  
ID  
TA = 85°C  
A
IDM  
IS  
–20  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
–2.3  
2.8  
–1.1  
1.3  
T
A = 25°C  
A = 85°C  
Maximum Power Dissipationa  
PD  
W
T
1.5  
0.85  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b,c  
TJ, Tstg  
–55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t 10 sec  
35  
75  
4
44  
94  
5
Maximum Junction-to-Ambienta  
RthJA  
Steady State  
Steady State  
°C/W  
Maximum Junction-to-Case  
RthJC  
Notes  
a. Surface Mounted on 1“ x 1“ FR4 Board.  
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is  
not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 71996  
S-51210–Rev. C, 27-Jun-05  
www.vishay.com  
1

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