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SI7902EDN-T1 PDF预览

SI7902EDN-T1

更新时间: 2024-09-14 07:14:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
6页 81K
描述
TRANSISTOR 5.6 A, 30 V, 0.028 ohm, N-CHANNEL, Si, POWER, MOSFET, 1212-8, POWERPAK-8, FET General Purpose Power

SI7902EDN-T1 数据手册

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Si7902EDN  
Vishay Siliconix  
Dual N-Channel 30-V (D-S) MOSFET, Common Drain  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
VDS (V)  
rDS(on) (Ω)  
ID (A)  
8.3  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07-mm Profile  
3000–V ESD Protection  
Pb-free  
Available  
0.028 at VGS = 4.5 V  
0.030 at VGS = 3.7 V  
0.043 at VGS = 2.5 V  
RoHS*  
8.0  
30  
COMPLIANT  
APPLICATIONS  
6.7  
Protection Switch for 1–2–Li–ion/LiP Batteries  
PowerPAK 1212-8  
D
D
S1  
3.30 mm  
3.30 mm  
1
G1  
2
S2  
3
G2  
4
1.8 kΩ  
1.8 kΩ  
D
G
G
2
1
8
D
7
D
6
D
5
Bottom View  
S
1
S
2
N-Channel  
N-Channel  
Ordering Information: Si7902EDN-T1  
Si7902EDN–T1–E3 (Lead (Pb)–free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 secs  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
30  
12  
V
VGS  
TA = 25 °C  
TA = 85 °C  
8.3  
6.0  
5.6  
4.0  
Continuous Drain Current (TJ = 150 °C)a  
ID  
A
IDM  
IS  
40  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
2.7  
3.2  
1.7  
1.3  
1.5  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 85 °C  
0.79  
Operating Junction and Storage Temperature Range  
Soldering Recommendationsb,c  
TJ, Tstg  
– 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
30  
Maximum  
Unit  
t 10 sec  
38  
82  
Maximum Junction-to-Ambienta  
RthJA  
Steady State  
Steady State  
65  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
1.9  
2.4  
Notes  
a. Surface Mounted on 1" x 1" FR4 Board.  
b. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is  
not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 71801  
S-51210–Rev. B, 27-Jun-05  
www.vishay.com  
1

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