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SI7846DP-T1-E3 PDF预览

SI7846DP-T1-E3

更新时间: 2024-09-13 12:14:51
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 148K
描述
N-Channel 150-V (D-S) MOSFET

SI7846DP-T1-E3 数据手册

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Si7846DP  
Vishay Siliconix  
N-Channel 150-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Definition  
TrenchFET® Power MOSFETS  
0.050 at VGS = 10 V  
6.7  
150  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
PWM Optimized for Fast Switching  
100 % Rg Tested  
PowerPAK SO-8  
APPLICATIONS  
Primary Side Switch for High Density DC/DC  
Telecom/Server 48 V DC/DC  
Industrial and 42 V Automotive  
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
D
8
D
7
D
6
D
G
5
Bottom View  
S
Ordering Information:  
Si7846DP-T1-E3 (Lead (Pb)-free)  
Si7846DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
150  
V
20  
24.5  
19.5  
TC = 25 °C  
C = 70 °C  
TA = 25 °C  
A = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)a  
ID  
6.7  
5.4  
4.0  
3.3  
T
A
Pulsed Drain Current  
Avalanche Current  
Continuous Source Current (Diode Conduction)a  
IDM  
IAS  
IS  
50  
25  
L = 0.1 mH  
4.3  
5.2  
3.3  
1.6  
1.9  
1.2  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typical  
19  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
24  
65  
Maximum Junction-to-Ambienta  
52  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
1.5  
1.8  
Notes  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71442  
S09-0537-Rev. F, 06-Apr-09  
www.vishay.com  
1

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