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SI7848BDP

更新时间： 2024-09-13 12:48:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 157K
描述
N-Channel 40-V (D-S) MOSFET

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SI7848BDP 数据手册

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Si7848BDP  
Vishay Siliconix  
N-Channel 40-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
•
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)f  
47  
Definition  
TrenchFET® Power MOSFET  
100 % Rg and UIS Tested  
0.009 at VGS = 10 V  
0.012 at VGS = 4.5 V  
•
•
•
40  
15 nC  
40  
Compliant to RoHS directive 2002/95/EC  
PowerPAK® SO-8  
APPLICATIONS  
•
DC/DC Converters  
- Synchronous Buck  
- Synchronous Rectifier  
S
6.15 mm  
5.15 mm  
1
S
D
2
S
3
G
4
D
8
D
7
D
G
6
D
5
Bottom View  
S
Ordering Information:  
Si7848BDP-T1-E3 (Lead (Pb)-free)  
Si7848BDP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
40  
20  
Unit  
V
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
47  
38  
16a, b  
12.8a, b  
50  
15  
11  
30  
3.5a, b  
36  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current  
Avalanche Current  
Avalanche Energy  
IDM  
IAS  
EAS  
L = 0.1 mH  
mJ  
A
T
C = 25 °C  
Continuous Source-Drain Diode Current  
IS  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
23  
Maximum Power Dissipation  
PD  
W
4.2a, b  
2.7a, b  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambienta, e  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
25  
Maximum  
Unit  
t ≤ 10 s  
Steady State  
30  
°C/W  
2.9  
3.5  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
d. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under Steady State conditions is 70 °C/W.  
f. Based on TC = 25 °C.  
Document Number: 74632  
S09-0532-Rev. C, 06-Apr-09  
www.vishay.com  
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