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SI7852DP-T1-GE3 PDF预览

SI7852DP-T1-GE3

更新时间: 2024-11-05 12:02:59
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 153K
描述
N-Channel 80-V (D-S) MOSFET

SI7852DP-T1-GE3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT
包装说明:SMALL OUTLINE, R-XDSO-C5针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.63Is Samacsys:N
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:80 V最大漏极电流 (Abs) (ID):7.6 A
最大漏极电流 (ID):7.6 A最大漏源导通电阻:0.0165 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XDSO-C5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):5.2 W
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SI7852DP-T1-GE3 数据手册

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Si7852DP  
Vishay Siliconix  
N-Channel 80-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
12.5  
10.9  
Available  
TrenchFET® Power MOSFETS  
0.0165 at VGS = 10 V  
0.022 at VGS = 6 V  
80  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
PWM Optimized for Fast Switching  
100 % Rg Tested  
PowerPAK SO-8  
APPLICATIONS  
Primary Side Switch for DC/DC Applications  
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
D
8
D
7
D
6
D
5
G
Bottom View  
S
Ordering Information:  
Si7852DP-T1-E3 (Lead (Pb)-free)  
Si7852DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
80  
V
VGS  
20  
TA = 25 °C  
TA = 70 °C  
12.5  
10.0  
7.6  
6.1  
Continuous Drain Current (TJ = 150 °C)a  
ID  
IDM  
IAS  
IS  
Pulsed Drain Current  
Avalanche Current  
Continuous Source Current (Diode Conduction)a  
50  
40  
A
L = 0.1 mH  
4.7  
5.2  
3.3  
1.7  
1.9  
1.2  
TA = 25 °C  
TA = 70 °C  
Maximum Power Dissipationa  
PD  
W
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typical  
19  
Maximum  
Unit  
t 10 s  
24  
65  
Maximum Junction-to-Ambienta  
Steady State  
Steady State  
52  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
1.5  
1.8  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71627  
S09-0268-Rev. E, 16-Feb-09  
www.vishay.com  
1

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