NTMS4917N
Power MOSFET
30 V, 10.5 A, N−Channel, SO−8
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• Optimized for 5 V, 12 V Gate Drives
http://onsemi.com
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
11 mW @ 10 V
15 mW @ 4.5 V
Applications
30 V
10.5 A
• DC−DC Converters
• Printers
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
N−Channel
J
Parameter
Drain−to−Source Voltage
Symbol Value Unit
D
V
30
20
V
V
A
DSS
Gate−to−Source Voltage
V
GS
Continuous Drain
Steady
State
I
D
T = 25°C
8.5
6.8
1.28
A
Current R
(Note 1)
q
G
JA
T = 70°C
A
Power Dissipation R
(Note 1)
Steady
State
T = 25°C
A
P
W
A
q
D
JA
JA
S
Continuous Drain
Steady
State
I
D
T = 25°C
A
7.1
5.7
Current R
(Note 2)
MARKING DIAGRAM/
PIN ASSIGNMENT
q
JA
T = 70°C
A
Power Dissipation R
(Note 2)
T = 25°C
A
P
I
0.88
W
A
q
D
1
8
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
1
Continuous Drain
Steady
State
T = 25°C
A
10.5
8.4
D
SO−8
CASE 751
STYLE 12
Current R , t v 10 s
q
JA
T = 70°C
A
(Note 1)
Top View
Power Dissipation
Steady
State
T = 25°C
A
P
D
1.95
W
R
, t v 10 s(Note 1)
q
JA
4917N = Device Code
Pulsed Drain Current
T = 25°C, t = 10 ms
A
I
DM
127
A
p
A
= Assembly Location
Y
= Year
= Work Week
= Pb−Free Package
Operating Junction and Storage Temperature
T ,
stg
−55 to
°C
J
T
150
WW
G
Source Current (Body Diode)
I
S
2.4
32
A
(Note: Microdot may be in either location)
Single Pulse Drain−to−Source Avalanche Energy
E
AS
mJ
(T = 25°C, V = 30 V, V = 10 V,
J
DD
GS
I = 8 A , L = 1.0 mH, R = 25 W)
ORDERING INFORMATION
L
pk
G
†
Lead Temperature for Soldering Purposes
T
260
°C
L
Device
Package
Shipping
2500/Tape & Reel
(1/8″ from case for 10 s)
NTMS4917NR2G
SO−8
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
°C/W
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 10 s (Note 1)
Junction−to−Foot (Drain)
R
R
97.4
64
q
q
JA
JA
R
R
25.9
142.4
q
JF
JA
Junction−to−Ambient – Steady State (Note 2)
q
1. Surfacemounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
April, 2011 − Rev. 0
NTMS4917N/D