Datasheet > NTMS4920N

NTMS4920N

更新时间： 2024-11-06 05:54:23

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
5页	128K
描述
Power MOSFET 30 V, 17 A, N−Channel, SO−8

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中文翻译

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NTMS4920N 数据手册

NTMS4920N

Power MOSFET

30 V, 17 A, N−Channel, SO−8

Features

• Low R

to Minimize Conduction Losses

DS(on)

• Low Capacitance to Minimize Driver Losses

• Optimized Gate Charge to Minimize Switching Losses

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

http://onsemi.com

DS(ON)

MAX

I MAX

(BR)DSS

Applications

• DC−DC Converters

• Points of Loads

• Power Load Switch

• Motor Controls

4.3 mW @ 10 V

5.7 mW @ 4.5 V

30 V

17 A

N−Channel

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

Parameter

Drain−to−Source Voltage

Symbol Value Unit

DSS

Gate−to−Source Voltage

Continuous Drain

Steady

State

T = 25°C

14.1

11.3

1.46

Current R

(Note 1)

T = 70°C

Power Dissipation R

(Note 1)

Steady

State

T = 25°C

Continuous Drain

Steady

State

T = 25°C

10.6

8.5

MARKING DIAGRAM/

PIN ASSIGNMENT

Current R

(Note 2)

T = 70°C

Power Dissipation R

(Note 2)

T = 25°C

0.82

Source

Gate

Drain

SO−8

CASE 751

STYLE 12

Continuous Drain

Steady

State

T = 25°C

Current R , t v 10 s

T = 70°C

13.6

2.12

(Note 1)

Top View

Power Dissipation

Steady

State

T = 25°C

R , t v 10 s(Note 1)

4920N = Device Code

= Assembly Location

= Year

= Work Week

= Pb−Free Package

Pulsed Drain Current

T = 25°C, t = 10 ms

136

Operating Junction and Storage Temperature

T ,

−55 to

150

°C

stg

Source Current (Body Diode)

2.1

(Note: Microdot may be in either location)

Single Pulse Drain−to−Source Avalanche Energy

162

(T = 25°C, V = 30 V, V = 10 V,

ORDERING INFORMATION

I = 18 A , L = 1.0 mH, R = 25 W)

†

Device

Package

Shipping

2500/Tape & Reel

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

260

°C

NTMS4920NR2G

SO−8

(Pb−Free)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter

Symbol Value Unit

°C/W

Junction−to−Ambient – Steady State (Note 1)

Junction−to−Ambient – t v 10 s (Note 1)

Junction−to−Foot (Drain)

85.5

Junction−to−Ambient – Steady State (Note 2)

152

1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq

[1 oz] including traces).

2. Surfacemounted on FR4 board using the minimum recommended pad size.

Semiconductor Components Industries, LLC, 2009

Publication Order Number:

September, 2009 − Rev. 1

NTMS4920N/D

12 3 4 5

中文翻译

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与NTMS4920N相关器件

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NTMS4920NR2G	ONSEMI	获取价格	Power MOSFET 30 V, 17 A, N−Channel, SO−8
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NTMS4935NR2G	ONSEMI	获取价格	Power MOSFET 30 V, 16 A, N−Channel, SO−8
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NTMS4N01R2	ONSEMI	获取价格	Power MOSFET 4.2 Amps, 20 Volts N−Channel Enhancement−Mode Single SO−8 P
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