NTD3055L104
Power MOSFET
12 Amps, 60 Volts, Logic Level
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
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Features
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
• Pb−Free Packages are Available
• Lower R
60 V
104 mW
12 A
DS(on)
• Lower V
• Tighter V Specification
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
DS(on)
N−Channel
SD
D
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
G
S
MARKING
DIAGRAMS
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol Value
Unit
Vdc
Vdc
Vdc
4
Drain−to−Source Voltage
V
60
60
Drain
DSS
Drain−to−Gate Voltage (R = 10 MW)
V
DGR
GS
4
DPAK
CASE 369C
STYLE 2
Gate−to−Source Voltage, Continuous
V
V
"15
"20
GS
GS
− Non−Repetitive (t v10 ms)
p
2
1
Drain Current
3
− Continuous @ T = 25°C
I
12
10
45
Adc
Apk
A
D
2
− Continuous @ T = 100°C
I
D
1
3
A
Drain
− Single Pulse (t v10 ms)
I
DM
Gate
p
Source
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
48
0.32
2.1
W
W/°C
W
A
D
4
Drain
Total Power Dissipation @ T = 25°C (Note 1)
A
4
Total Power Dissipation @ T = 25°C (Note 2)
1.5
W
A
DPAK−3
CASE 369D
STYLE 2
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
T , T
J
−55 to
+175
°C
stg
E
AS
61
mJ
1
Energy − Starting T = 25°C
J
2
3
(V = 25 Vdc, V = 5.0 Vdc, L = 1.0 mH
DD
GS
I
= 11 A, V = 60 Vdc)
DS
L(pk)
1
2
3
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
R
3.13
71.4
100
°C/W
°C
Gate Drain Source
q
JC
JA
JA
q
q
55L104
A
Y
= Device Code
= Assembly Location
= Year
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
260
L
W
= Work Week
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1. When surface mounted to an FR4 board using 1″ pad size,
2
(Cu Area 1.127 in ).
2. When surface mounted to an FR4 board using the minimum recommended
2
pad size, (Cu Area 0.412 in ).
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
August, 2004 − Rev. 4
NTD3055L104/D