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NTD32N06L-001 PDF预览

NTD32N06L-001

更新时间： 2024-11-30 12:56:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 70K
描述
Power MOSFET 32 Amps, 60 Volts

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NTD32N06L-001 数据手册

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NTD32N06L  
Power MOSFET  
32 Amps, 60 Volts, Logic Level  
N−Channel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
Features  
V
R
TYP  
I MAX  
D
DSS  
DS(ON)  
• Smaller Package than MTB30N06VL  
• Lower R  
60 V  
23.7 mW  
32 A  
, V  
, and Total Gate Charge  
DS(on)  
DS(on)  
• Lower and Tighter V  
• Lower Diode Reverse Recovery Time  
• Lower Reverse Recovery Stored Charge  
SD  
N−Channel  
D
Typical Applications  
• Power Supplies  
• Converters  
• Power Motor Controls  
• Bridge Circuits  
G
4
S
MARKING DIAGRAMS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
4
Rating  
Symbol Value Unit  
Drain  
2
3
1
Drain−to−Source Voltage  
V
V
60  
60  
Vdc  
Vdc  
Vdc  
DSS  
Drain−to−Gate Voltage (R = 10 MW)  
DPAK  
GS  
DGR  
CASE 369C  
(Surface Mount)  
Style 2  
Gate−to−Source Voltage  
− Continuous  
V
V
"20  
"30  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
2
Drain Current  
− Continuous @ T = 25°C  
1
Gate  
3
4
Drain  
I
I
32  
22  
90  
Adc  
D
D
Source  
A
− Continuous @ T = 100°C  
A
4
I
Apk  
W
DM  
− Single Pulse (t v10 ms)  
p
Drain  
Total Power Dissipation @ T = 25°C  
P
93.75  
A
D
0.625 W/°C  
1
2
3
Derate above 25°C  
Total Power Dissipation @ T = 25°C (Note 1)  
Total Power Dissipation @ T = 25°C (Note 2)  
2.88  
1.5  
W
W
A
A
DPAK  
CASE 369D  
(Straight Lead)  
Style 2  
Operating and Storage Temperature Range  
T , T  
−55 to  
+175  
°C  
J
stg  
Single Pulse Drain−to−Source Avalanche  
E
AS  
313  
mJ  
Energy − Starting T = 25°C (Note 3)  
J
1
2
3
32N06L  
Y
WW  
Device Code  
= Year  
= Work Week  
(V = 50 Vdc, V = 5 Vdc, L = 1.0 mH,  
DD  
GS  
Gate Drain Source  
I
= 25 A, V = 60 Vdc, R = 25 W)  
DS G  
L(pk)  
Thermal Resistance  
− Junction−to−Case  
°C/W  
°C  
R
R
R
1.6  
52  
100  
q
JC  
JA  
JA  
ORDERING INFORMATION  
q
q
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
†
Device  
Package  
Shipping  
Maximum Lead Temperature for Soldering  
Purposes, 1/8″ from case for 10 seconds  
T
260  
L
NTD32N06L  
DPAK  
75 Units/Rail  
DPAK  
Straight Lead  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
NTD32N06L−1  
75 Units/Rail  
NTD32N06LT4  
DPAK  
2500/Tape & Reel  
1. When surface mounted to FR4 board using 0.5″ pad size.  
2. When surface mounted to FR4 board using minimum recommended pad  
size.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
3. Repetitive rating; pulse width limited by maximum junction temperature.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 3  
NTD32N06L/D  
 
12345678

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