NTD32N06L
Power MOSFET
32 Amps, 60 Volts
Logic Level, N-Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
V
DSS
R
TYP
I MAX
D
DS(ON)
Features
•ꢀSmaller Package than MTB30N06VL
60 V
23.7 mW
32 A
•ꢀLower R
, V
, and Total Gate Charge
DS(on)
DS(on)
•ꢀLower and Tighter V
N-Channel
SD
D
•ꢀLower Diode Reverse Recovery Time
•ꢀLower Reverse Recovery Stored Charge
•ꢀPb-Free Packages are Available
Typical Applications
•ꢀPower Supplies
•ꢀConverters
G
S
•ꢀPower Motor Controls
•ꢀBridge Circuits
MARKING DIAGRAMS
& PIN ASSIGNMENTS
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
4
Drain
Rating
Symbol Value
Unit
Drain-to-Source Voltage
V
V
60
60
Vdc
Vdc
Vdc
DSS
Drain-to-Gate Voltage (R = 10 MW)
GS
DGR
4
DPAK
Gate-to-Source Voltage
- Continuous
V
V
"20
"30
CASE 369C
(Surface Mount)
STYLE 2
GS
GS
- Non-Repetitive (t v10 ms)
p
2
1
Drain Current - Continuous @ T = 25°C
I
32
22
90
Adc
Apk
3
A
D
- Continuous @ T = 100°C
I
D
A
2
Drain
I
DM
1
Gate
- Single Pulse (t v10 ms)
3
Source
p
Total Power Dissipation @ T = 25°C
P
D
93.75
0.625
2.88
1.5
W
W/°C
W
A
Derate above 25°C
Total Power Dissipation @ T = 25°C (Note 1)
Total Power Dissipation @ T = 25°C (Note 2)
A
4
Drain
W
A
Operating and Storage Temperature Range
T , T
J
-ꢁ55 to
+175
°C
4
stg
DPAK
CASE 369D
(Straight Lead)
STYLE 2
Single Pulse Drain-to-Source Avalanche
Energy - Starting T = 25°C (Note 3)
E
313
mJ
AS
J
(V = 50 Vdc, V = 5 Vdc, L = 1.0 mH,
DD
GS
1
I
= 25 A, V = 60 Vdc, R = 25 W)
DS G
L(pk)
2
3
Thermal Resistance
Junction-to-Case
°C/W
°C
-
R
R
R
1.6
52
100
q
JC
JA
JA
- Junction-to-Ambient (Note 1)
- Junction-to-Ambient (Note 2)
1
2
3
Gate Drain Source
q
q
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T
260
L
Y
WW
= Year
= Work Week
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
32N06L
G
= Device Code
= Pb-Free Package
1. When surface mounted to FR4 board using 0.5 in pad size.
2. When surface mounted to FR4 board using minimum recommended pad size.
3. Repetitive rating; pulse width limited by maximum junction temperature.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
©ꢀ Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 5
1
Publication Order Number:
NTD32N06L/D