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NTD40N03R-1G PDF预览

NTD40N03R-1G

更新时间: 2024-11-17 21:54:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 69K
描述
Power MOSFET 45 Amps, 25 Volts

NTD40N03R-1G 技术参数

是否无铅: 不含铅生命周期:Obsolete
包装说明:LEAD FREE, CASE 369D-01, DPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:1 week风险等级:5.39
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:25 V最大漏极电流 (Abs) (ID):32 A
最大漏极电流 (ID):32 A最大漏源导通电阻:0.023 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):41.7 W最大脉冲漏极电流 (IDM):100 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

NTD40N03R-1G 数据手册

 浏览型号NTD40N03R-1G的Datasheet PDF文件第2页浏览型号NTD40N03R-1G的Datasheet PDF文件第3页浏览型号NTD40N03R-1G的Datasheet PDF文件第4页浏览型号NTD40N03R-1G的Datasheet PDF文件第5页浏览型号NTD40N03R-1G的Datasheet PDF文件第6页浏览型号NTD40N03R-1G的Datasheet PDF文件第7页 
NTD40N03R  
Power MOSFET  
45 Amps, 25 Volts  
N−Channel DPAK  
Features  
http://onsemi.com  
Planar HD3e Process for Fast Switching Performance  
Low R  
to Minimize Conduction Loss  
DS(on)  
45 AMPERES, 25 VOLTS  
Low C to Minimize Driver Loss  
iss  
Low Gate Charge  
RDS(on) = 12.6 mW (Typ)  
Optimized for High Side Switching Requirements in  
High−Efficiency DC−DC Converters  
N−CHANNEL  
D
Pb−Free Packages are Available  
MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
G
V
25  
Vdc  
Vdc  
DSS  
S
Gate−to−Source Voltage − Continuous  
Thermal Resistance − Junction−to−Case  
V
±20  
GS  
R
P
3.0  
50  
°C/W  
W
q
JC  
4
Total Power Dissipation @ T = 25°C  
C
D
Drain Current  
4
− Continuous @ T = 25°C, Chip  
− Continuous @ T = 25°C, Limited by Wires  
− Single Pulse (tp 10 ms)  
I
I
I
45  
32  
100  
A
A
A
C
D
A
D
D
2
1
1
2
3
Thermal Resistance − Junction−to−Ambient  
(Note 1)  
R
71.4  
°C/W  
q
JA  
3
CASE 369AA  
DPAK  
(Surface Mount)  
CASE 369D  
DPAK  
Total Power Dissipation @ T = 25°C  
Drain Current − Continuous @ T = 25°C  
P
2.1  
9.2  
W
A
A
D
I
D
A
(Straight Lead)  
STYLE 2  
STYLE 2  
Thermal Resistance − Junction−to−Ambient  
(Note 2)  
R
100  
°C/W  
q
JA  
Total Power Dissipation @ T = 25°C  
P
1.5  
7.8  
W
A
A
D
MARKING DIAGRAM  
& PIN ASSIGNMENTS  
Drain Current − Continuous @ T = 25°C  
I
D
A
Operating and Storage Temperature Range  
T , T  
J
−55 to  
175  
°C  
stg  
4 Drain  
4 Drain  
Maximum Lead Temperature for Soldering  
T
L
260  
°C  
Purposes, 1/8from case for 10 seconds  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
1. When surface mounted to an FR4 board using 0.5 sq. in pad size.  
2. When surface mounted to an FR4 board using minimum recommended  
pad size.  
1
Gate  
3
2
Source  
1
Gate  
3
Drain  
Source  
2
Drain  
40N03= Device Code  
= Year  
WW = Work Week  
Y
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 5  
NTD40N03R/D  
 

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