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NTD32N06-1G PDF预览

NTD32N06-1G

更新时间: 2024-11-18 03:45:51
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 72K
描述
32 Amps, 60 Volts, N−Channel DPAK

NTD32N06-1G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, CASE 369D-01, DPAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:7.29
雪崩能效等级(Eas):313 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):32 A最大漏极电流 (ID):32 A
最大漏源导通电阻:0.026 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):93.75 W最大脉冲漏极电流 (IDM):90 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:NO端子面层:Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD32N06-1G 数据手册

 浏览型号NTD32N06-1G的Datasheet PDF文件第2页浏览型号NTD32N06-1G的Datasheet PDF文件第3页浏览型号NTD32N06-1G的Datasheet PDF文件第4页浏览型号NTD32N06-1G的Datasheet PDF文件第5页浏览型号NTD32N06-1G的Datasheet PDF文件第6页浏览型号NTD32N06-1G的Datasheet PDF文件第7页 
NTD32N06  
Power MOSFET  
32 Amps, 60 Volts, N−Channel DPAK  
Designed for low voltage, high speed switching applications in  
power supplies, converters and power motor controls and bridge  
circuits.  
http://onsemi.com  
Features  
Pb−Free Packages are Available  
Smaller Package than MTB36N06V  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
60 V  
26 mW  
32 A  
Lower R  
DS(on)  
Lower V  
Lower Total Gate Charge  
Lower and Tighter V  
DS(on)  
N−Channel  
D
SD  
Lower Diode Reverse Recovery Time  
Lower Reverse Recovery Stored Charge  
Typical Applications  
G
Power Supplies  
Converters  
Power Motor Controls  
Bridge Circuits  
S
MARKING  
DIAGRAMS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
Vdc  
4
Drain  
Drain−to−Source Voltage  
V
DSS  
DGR  
Drain−to−Gate Voltage (R = 10 MW)  
V
60  
GS  
4
DPAK  
CASE 369C  
STYLE 2  
Gate−to−Source Voltage, Continuous  
V
V
"20  
"30  
GS  
GS  
− Non−Repetitive (t v10 ms)  
p
2
1
Drain Current  
− Continuous @ T = 25°C  
3
I
D
32  
22  
90  
Adc  
Apk  
A
2
− Continuous @ T = 100°C  
I
D
A
1
Gate  
3
Drain  
− Single Pulse (t v10 ms)  
I
DM  
p
Source  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
93.75  
0.625  
2.88  
1.5  
W
W/°C  
W
A
4
Total Power Dissipation @ T = 25°C (Note 1)  
Drain  
A
Total Power Dissipation @ T = 25°C (Note 2)  
W
A
4
DPAK−3  
CASE 369D  
STYLE 2  
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
Single Pulse Drain−to−Source Avalanche  
E
AS  
313  
mJ  
Energy − Starting T = 25°C (Note 3)  
J
1
(V = 50 Vdc, V = 10 Vdc, L = 1.0 mH,  
DD  
GS  
2
3
I
= 25 A, V = 60 Vdc, R = 25 W)  
DS G  
L(pk)  
Thermal Resistance − Junction−to−Case  
− Junction−to−Ambient (Note 1)  
− Junction−to−Ambient (Note 2)  
R
R
R
1.6  
52  
100  
°C/W  
°C  
1
2
3
q
JC  
JA  
JA  
Gate Drain Source  
q
q
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10 seconds  
T
260  
32N06  
A
Y
= Device Code  
= Assembly Location  
= Year  
L
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
WW  
= Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
1. When surface mounted to an FR4 board using 1pad size,  
2
(Cu Area 1.127 in ).  
2. When surface mounted to an FR4 board using minimum recommended pad  
2
size, (Cu Area 0.412 in ).  
3. Repetitive rating; pulse width limited by maximum junction temperature.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 3  
NTD32N06/D  
 

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