60
Vdc
Emitter
-ꢁBase Voltage
V
6.0
Vdc
Collector
Collector
V
CEO
V
CBO
MBT3904DW1T1,
MBT3904DW2T1
Dual General Purpose
Transistors
The MBT3904DW1T1 and MBT3904DW2T1 devices are a
spin-of f of our popular SOT-23/SOT-323 three-leaded device. It is
designed for general purpose amplifier applications and is housed in
the SOT-363 six-leaded surface mount package. By putting two
discrete devices in one package, this device is ideal for low-power
surface mount applications where board space is at a premium.
http://onsemi.com
MARKING
DIAGRAM
6
SOT-363/SC-88/
SC70-6
CASE 419B
XX MG
Features
6
G
•ꢀh , 100-300
FE
1
1
•ꢀLow V
, ≤ 0.4 V
CE(sat)
XX =MA for MBT3904DW1T1
MJ for MBT3904DW2T1
M =Date Code
•ꢀSimplifies Circuit Design
•ꢀReduces Board Space
G
= Pb-Free Package
(Note: Microdot may be in either location)
•ꢀReduces Component Count
•ꢀAvailable in 8 mm, 7-inch/3,000 Unit Tape and Reel
•ꢀPb-Free Packages are Available
(3)
(2)
(1)
Q
MAXIMUM RATINGS
Q
1
2
Rating
-ꢁEmitter Voltage
-ꢁBase Voltage
Symbol
Value
40
Unit
Vdc
(4)
(5)
(6)
EBO
MBT3904DW1T1
STYLE 1
Collector Current - Continuous
Electrostatic Discharge
I
C
200
mAdc
ESD
HBM Class 2
MM Class B
(3)
(2)
(1)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Q
2
Q
1
THERAML CHARACTERISTICS
(4)
(5)
(6)
Characteristic
Symbol
Max
Unit
MBT3904DW2T1
STYLE 27
Total Package Dissipation (Note 1)
T = 25°C
P
D
150
mW
A
Thermal Resistance,
Junction-to-Ambient
R
833
°C/W
°C
ORDERING INFORMATION
q
JA
†
Device
Shipping
Package
Junction and Storage
Temperature Range
T , T
J
-ꢁ55 to +150
stg
MBT3904DW1T1
3000 Units/Reel
3000 Units/Reel
SOT-363
MBT3904DW1T1G
SOT-363
(Pb-Free)
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
MBT3904DW2T1
3000 Units/Reel
3000 Units/Reel
SOT-363
MBT3904DW2T1G
SOT-363
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2007
May, 2005 - Rev. 5
1
Publication Order Number:
MBT3904DW1T1/D