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MBT3904DW2 PDF预览

MBT3904DW2

更新时间: 2024-09-27 01:17:55
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安森美 - ONSEMI /
页数 文件大小 规格书
8页 102K
描述
Dual General Purpose Transistors

MBT3904DW2 数据手册

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MBT3904DW1,  
MBT3904DW2,  
SMBT3904DW1,  
NSVMBT3904DW1  
Dual General Purpose  
Transistors  
www.onsemi.com  
MARKING  
DIAGRAM  
The MBT3904DW1 and MBT3904DW2 devices are a spin−off of  
our popular SOT−23/SOT−323 three−leaded device. It is designed for  
general purpose amplifier applications and is housed in the SOT−363  
six−leaded surface mount package. By putting two discrete devices in  
one package, this device is ideal for low−power surface mount  
applications where board space is at a premium.  
6
SOT−363/SC−88/  
SC70−6  
CASE 419B  
XX MG  
6
G
1
1
Features  
XX=MA for MBT3904DW1T1G  
MJ for MBT3904DW2T1G  
M =Date Code  
h , 100−300  
FE  
Low V  
, 0.4 V  
CE(sat)  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
(3)  
(2)  
(1)  
Q
Available in 8 mm, 7−inch/3,000 Unit Tape and Reel  
S and NSV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
Q
1
2
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
(4)  
(5)  
(6)  
MBT3904DW1T1  
STYLE 1  
MAXIMUM RATINGS  
(3)  
(2)  
(1)  
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
40  
Unit  
Vdc  
V
CEO  
V
CBO  
V
EBO  
Q
2
60  
Vdc  
Q
1
6.0  
Vdc  
Collector Current − Continuous  
Electrostatic Discharge  
I
200  
mAdc  
C
(4)  
(5)  
(6)  
ESD  
HBM Class 2  
MM Class B  
MBT3904DW2T1  
STYLE 27  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
Device  
Shipping  
Package  
THERMAL CHARACTERISTICS  
MBT3904DW1T1G,  
MBT3904DW2T1G  
3000 /  
SOT−363  
(Pb−Free)  
Characteristic  
Symbol  
Max  
Unit  
Tape & Reel  
3000 /  
Total Package Dissipation (Note 1)  
T = 25°C  
A
P
D
150  
mW  
SMBT3904DW1T1G  
SOT−363  
(Pb−Free) Tape & Reel  
Thermal Resistance,  
Junction−to−Ambient  
R
833  
°C/W  
°C  
q
JA  
NSVMBT3904DW1T3G  
10000 /  
Tape & Reel  
SOT−363  
(Pb−Free)  
Junction and Storage  
Temperature Range  
T , T  
55 to +150  
J
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum  
recommended footprint.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
June, 2015 − Rev. 11  
MBT3904DW1T1/D  
 

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