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MBT3906DW1 PDF预览

MBT3906DW1

更新时间: 2024-09-27 01:11:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 132K
描述
Dual General Purpose Transistor

MBT3906DW1 数据手册

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MBT3906DW1,  
SMBT3906DW1  
Dual General Purpose  
Transistor  
The MBT3906DW1 device is a spinoff of our popular  
SOT23/SOT323 threeleaded device. It is designed for general  
purpose amplifier applications and is housed in the SOT363  
sixleaded surface mount package. By putting two discrete devices in  
one package, this device is ideal for lowpower surface mount  
applications where board space is at a premium.  
http://onsemi.com  
Features  
SOT363/SC88  
CASE 419B  
STYLE 1  
h , 100300  
FE  
Low V  
, 0.4 V  
CE(sat)  
Simplifies Circuit Design  
(3)  
(2)  
(1)  
Q
Reduces Board Space  
Reduces Component Count  
Available in 8 mm, 7inch/3,000 Unit Tape and Reel  
Q
1
2
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AECQ101 Qualified and  
PPAP Capable  
(4)  
(5)  
(6)  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant*  
MARKING DIAGRAM  
MAXIMUM RATINGS  
6
Rating  
Symbol  
Value  
40  
Unit  
Vdc  
A2 M G  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
V
CEO  
V
CBO  
V
EBO  
G
40  
Vdc  
1
5.0  
200  
Vdc  
A2 = Device Code  
M = Date Code  
Collector Current Continuous  
Electrostatic Discharge  
I
C
mAdc  
G
= PbFree Package  
ESD  
HBM Class 2  
MM Class B  
(Note: Microdot may be in either location)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
THERMAL CHARACTERISTICS  
MBT3906DW1T1G  
SOT363  
(PbFree)  
3,000 /  
Tape & Reel  
Characteristic  
Symbol  
Max  
Unit  
MBT3906DW1T2G  
SOT363  
(PbFree)  
3,000 /  
Tape & Reel  
Total Package Dissipation (Note 1)  
T = 25°C  
A
P
D
150  
mW  
SMBT3906DW1T1G SOT363  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance,  
JunctiontoAmbient  
R
833  
°C/W  
°C  
q
JA  
Junction and Storage  
Temperature Range  
T , T  
J
55 to +150  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
stg  
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum  
recommended footprint.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
July, 2013 Rev. 5  
MBT3906DW1T1/D  
 

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