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MBT3906DW1T1G_09 PDF预览

MBT3906DW1T1G_09

更新时间: 2024-11-14 11:11:19
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 174K
描述
Dual General Purpose Transistor

MBT3906DW1T1G_09 数据手册

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MBT3906DW1T1G  
Dual General Purpose  
Transistor  
The MBT3906DW1T1G device is a spinoff of our popular  
SOT23/SOT323 threeleaded device. It is designed for general  
purpose amplifier applications and is housed in the SOT363  
sixleaded surface mount package. By putting two discrete devices in  
one package, this device is ideal for lowpower surface mount  
applications where board space is at a premium.  
http://onsemi.com  
(3)  
(2)  
(1)  
Q
Features  
h , 100300  
FE  
Q
1
2
Low V  
, 0.4 V  
Simplifies Circuit Design  
CE(sat)  
(4)  
(5)  
(6)  
Reduces Board Space  
Reduces Component Count  
Available in 8 mm, 7inch/3,000 Unit Tape and Reel  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
1
MAXIMUM RATINGS  
SOT363/SC88  
CASE 419B  
STYLE 1  
Rating  
Symbol  
Value  
40  
Unit  
Vdc  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
V
CEO  
V
CBO  
V
EBO  
40  
Vdc  
MARKING DIAGRAM  
5.0  
200  
Vdc  
Collector Current Continuous  
Electrostatic Discharge  
I
C
mAdc  
6
ESD  
HBM Class 2  
MM Class B  
A2 M G  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1
A2 = Device Code  
M = Date Code  
= PbFree Package  
(Note: Microdot may be in either location)  
THERMAL CHARACTERISTICS  
G
Characteristic  
Symbol  
Max  
Unit  
Total Package Dissipation (Note 1)  
P
D
150  
mW  
T = 25°C  
A
ORDERING INFORMATION  
Thermal Resistance,  
JunctiontoAmbient  
R
833  
°C/W  
°C  
q
JA  
Device  
Package  
Shipping  
Junction and Storage  
Temperature Range  
T , T  
J
55 to +150  
MBT3906DW1T1G SOT363  
(PbFree)  
3000 /  
stg  
Tape & Reel  
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum  
recommended footprint.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 Rev. 3  
MBT3906DW1T1/D  
 

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