MBT3906DW1,
SMBT3906DW1
Dual General Purpose
Transistor
The MBT3906DW1 device is a spin−off of our popular
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
http://onsemi.com
Features
SOT−363/SC−88
CASE 419B
STYLE 1
• h , 100−300
FE
• Low V
, ≤ 0.4 V
CE(sat)
• Simplifies Circuit Design
(3)
(2)
(1)
Q
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
Q
1
2
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
(4)
(5)
(6)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MARKING DIAGRAM
MAXIMUM RATINGS
6
Rating
Symbol
Value
−40
Unit
Vdc
A2 M G
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
V
CBO
V
EBO
G
−40
Vdc
1
−5.0
−200
Vdc
A2 = Device Code
M = Date Code
Collector Current − Continuous
Electrostatic Discharge
I
C
mAdc
G
= Pb−Free Package
ESD
HBM Class 2
MM Class B
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
THERMAL CHARACTERISTICS
MBT3906DW1T1G
SOT−363
(Pb−Free)
3,000 /
Tape & Reel
Characteristic
Symbol
Max
Unit
MBT3906DW1T2G
SOT−363
(Pb−Free)
3,000 /
Tape & Reel
Total Package Dissipation (Note 1)
T = 25°C
A
P
D
150
mW
SMBT3906DW1T1G SOT−363
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance,
Junction−to−Ambient
R
833
°C/W
°C
q
JA
Junction and Storage
Temperature Range
T , T
J
−55 to +150
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
stg
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
July, 2013 − Rev. 5
MBT3906DW1T1/D