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IXTQ180N055T PDF预览

IXTQ180N055T

更新时间: 2024-02-02 01:50:02
品牌 Logo 应用领域
IXYS
页数 文件大小 规格书
5页 116K
描述
Trench Gate Power MOSFET

IXTQ180N055T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TO-3P
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.83雪崩能效等级(Eas):450 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (ID):180 A
最大漏源导通电阻:0.0051 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):600 A
认证状态:Not Qualified表面贴装:NO
端子面层:PURE TIN端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXTQ180N055T 数据手册

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Advance Technical Information  
IXTQ 180N055T  
IXTA 180N055T  
IXTP 180N055T  
VDSS = 55 V  
ID25 = 180 A  
RDS(on) = 4.0 mΩ  
Trench Gate  
Power MOSFET  
N-Channel Enhancement Mode  
TO-3P(IXTQ)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 175°C  
TJ = 25°C to 175°C; RGS = 1 MΩ  
55  
55  
V
V
G
D
(TAB)  
S
VGSM  
20  
V
TO-220 (IXTP)  
ID25  
IDRMS  
IDM  
TC = 25°C  
External lead current limit  
TC = 25°C, pulse width limited by TJM  
180  
75  
600  
A
A
A
IAR  
TC = 25°C  
TC = 25°C  
75  
1.0  
3
A
J
(TAB)  
G
D
S
EAS  
dv/dt  
TO-263 (IXTA)  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 10 Ω  
,
V/ns  
PD  
TC = 25°C  
360  
W
G
TJ  
TJM  
Tstg  
-55 ... +175  
175  
-55 ... +150  
°C  
°C  
°C  
S
(TAB)  
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Maximum tab temperature for soldering  
TO-263 package for 10s  
300  
260  
°C  
°C  
Features  
Md  
Mounting torque  
(TO-3P / TO-220)  
1.13/10 Nm/lb.in.  
z International standard packages  
z Unclamped Inductive Switching (UIS)  
rated  
z Low package inductance  
- easy to drive and to protect  
Weight  
TO-3P  
TO-220  
TO-263  
5.5  
4
3
g
g
g
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
Advantages  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 1 mA  
VGS = 20 VDC, VDS = 0  
55  
V
V
z
Easy to mount  
Space savings  
High power density  
2.0  
4.0  
z
z
200  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
1
250  
µA  
µA  
TJ = 125°C  
RDS(on)  
VGS = 10 V, ID = 50 A  
3.3  
4.0 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
DS99342(02/05)  
© 2005 IXYS All rights reserved  

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