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IXFT60N20 PDF预览

IXFT60N20

更新时间: 2024-11-05 11:14:07
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页数 文件大小 规格书
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描述
HiPerFET Power MOSFETs

IXFT60N20 技术参数

是否无铅: 不含铅生命周期:Transferred
零件包装代码:TO-268包装说明:SMALL OUTLINE, R-PSSO-G2
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.76
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):2500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):60 A最大漏极电流 (ID):60 A
最大漏源导通电阻:0.033 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-268JESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):300 W
最大脉冲漏极电流 (IDM):240 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFT60N20 数据手册

 浏览型号IXFT60N20的Datasheet PDF文件第2页 
ADVANCE TECHNICAL INFORMATION  
HiPerFETTM  
Power MOSFETs  
VDSS = 200 V  
ID25 = 60 A  
RDS(on) = 33 mΩ  
IXFH 60N20  
IXFT 60N20  
N-ChannelEnhancementMode  
AvalancheRated,Highdv/dt  
t 250 ns  
rr  
Symbol  
TestConditions  
Maximum Ratings  
TO-247AD(IXFH)  
VDSS  
VDGR  
VGS  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
Continuous  
200  
200  
±20  
±30  
60  
V
V
V
V
A
(TAB)  
VGSM  
ID25  
Transient  
TC = 25°C  
IDM  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
240  
60  
50  
2.5  
5
A
A
IAR  
TO-268 ( IXFT) Case Style  
EAR  
EAS  
dv/dt  
TC = 25°C  
mJ  
J
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
V/ns  
G
S
(TAB)  
PD  
TJ  
TC = 25°C  
300  
-55 to +150  
150  
W
°C  
°C  
°C  
G = Gate  
S = Source TAB = Drain  
D
= Drain  
TJM  
Tstg  
-55 to +150  
TL  
1.6 mm (0.063 in) from case for 10 s  
Mounting torque  
300  
°C  
Md  
1.13/10 Nm/lb.in.  
Features  
Weight  
TO-247  
TO-268  
6
4
g
g
l
International standard packages  
Low RDS (on)  
l
l
Rated for unclamped Inductive load  
switching (UIS)  
l
Molding epoxies meet UL 94 V-0  
flammability classification  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min.  
typ.  
max.  
Advantages  
VDSS  
VGS = 0 V, ID = 250µA  
200  
2.0  
V
V
l
Easy to mount  
Space savings  
l
VGS(th)  
VDS = VGS, ID = 4 mA  
4.0  
l
High power density  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100  
nA  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
25  
1
µA  
mA  
RDS(on)  
VGS = 10 V, ID = 0.5 ID25  
33 mΩ  
Pulse test, t 300 µs, duty cycle d 2 %  
© 2001 IXYS All rights reserved  
98845 (6/01)  

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