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IRHN7054D PDF预览

IRHN7054D

更新时间: 2024-10-30 20:03:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 240K
描述
Power Field-Effect Transistor,

IRHN7054D 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.71
Base Number Matches:1

IRHN7054D 数据手册

 浏览型号IRHN7054D的Datasheet PDF文件第2页浏览型号IRHN7054D的Datasheet PDF文件第3页浏览型号IRHN7054D的Datasheet PDF文件第4页浏览型号IRHN7054D的Datasheet PDF文件第5页浏览型号IRHN7054D的Datasheet PDF文件第6页浏览型号IRHN7054D的Datasheet PDF文件第7页 
PD-90884E  
IRHN7054  
JANSR2N7394U  
60V, N-CHANNEL  
REF: MIL-PRF-19500/603  
RAD-Hard HEXFET TECHNOLOGY  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-1)  
Product Summary  
Part Number  
IRHN7054  
IRHN3054  
IRHN4054  
IRHN8054  
Radiation Level  
100 kRads(Si)  
300 kRads(Si)  
500 kRads(Si)  
1000 kRads(Si)  
RDS(on)  
ID  
QPL Part Number  
JANSR2N7394U  
JANSF2N7394U  
JANSG2N7394U  
JANSH2N7394U  
35A  
35A  
35A  
35A  
0.027  
0.027  
0.027  
0.040  
Description  
Features  
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Electrically Isolated  
Ceramic package  
IR HiRel RAD-Hard HEXFETtechnology provides high performance  
power MOSFETs for space applications. This technology  
has over a decade of proven performance and reliability in  
satellite applications. These devices have been characterized  
for both Total Dose and Single Event Effects (SEE). The  
combination of low Rdson and low gate charge reduces  
the power losses in switching applications such as DC to  
DC converters and motor control. These devices retain all  
of the well established advantages of MOSFETs such as  
voltage control, fast switching, ease of paralleling and  
temperature stability of electrical parameters.  
Light Weight  
Surface Mount  
ESD Rating: Class 3A per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Parameter  
Pre-Irradiation  
Units  
35  
ID @ VGS = 12V, TC = 25°C Continuous Drain Current  
ID @ VGS = 12V, TC = 100°C Continuous Drain Current  
30  
A
140  
150  
1.2  
IDM  
Pulsed Drain Current  
W
W/°C  
V
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
± 20  
500  
VGS  
EAS  
IAR  
mJ  
A
35  
15  
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
Storage Temperature Range  
Lead Temperature  
3.5  
-55 to + 150  
TSTG  
°C  
g
300 (5 sec)  
2.6 (Typical)  
Weight  
For Footnotes, refer to the page 2.  
1
2016-06-30  

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