PD - 96995E
IRF6646
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS compliant containing no lead or bromide
l Low Profile (<0.7 mm)
VDSS
80V max ±20V max
VGS
RDS(on)
7.6mΩ@ 10V
Vgs(th)
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
Qg tot
Qgd
36nC
12nC
3.8V
l Optimized for High Frequency Switching
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
l Low Conduction Losses
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
MN
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
M N
SQ
SX
ST
MQ
M X
MT
Description
The IRF6646 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6646 is optimized for primary side bridge topologies in isolated DC-DC applications, for 48V(±10%) or 36V to 60V ETSI input voltage
range systems, and is also ideal for secondary side synchronous rectification in regulated isolated DC-DC topologies. The reduced total losses
in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance isolated DC-DC converters.
Absolute Maximum Ratings
Max.
80
Parameter
Units
V
VDS
Drain-to-Source Voltage
±20
12
V
Gate-to-Source Voltage
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
9.6
68
@ TA = 70°C
@ TC = 25°C
A
96
DM
EAS
IAR
230
7.2
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
0.05
0.04
0.03
0.02
0.01
0
12.0
10.0
8.0
I
= 7.2A
I = 7.2A
D
D
V
= 40V
DS
DS
V
= 16V
6.0
T
= 125°C
4.0
J
2.0
T
= 25°C
J
0.0
4
6
8
10
12
14
16
0
10
Q
20
30
40
Total Gate Charge (nC)
G
V
Gate -to -Source Voltage (V)
GS,
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs. Gate-to-Source
Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 8.8mH, RG = 25Ω, IAS = 7.2A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
www.irf.com
1
11/04/05