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IRF66451PBF PDF预览

IRF66451PBF

更新时间: 2024-09-10 01:23:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 239K
描述
RoHS Compliant, Halogen-Free

IRF66451PBF 数据手册

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IRF6645PbF  
IRF6645TRPbF  
DirectFET™ Power MOSFET ‚  
Typical values (unless otherwise specified)  
l RoHS Compliant, Halogen-Free ‚  
l Lead-Free (Qualified up to 260°C Reflow)   
l Application Specific MOSFETs  
VDSS  
VGS  
RDS(on)  
28mΩ@ 10V  
Vgs(th)  
100V max ±20V max  
l Ideal for High Performance Isolated Converter  
Primary Switch Socket  
l Optimized for Synchronous Rectification  
l Low Conduction Losses  
Qg tot  
Qgd  
14nC  
4.8nC  
4.0V  
l High Cdv/dt Immunity  
l Low Profile (<0.7mm)  
l Dual Sided Cooling Compatible   
l Compatible with existing Surface Mount Techniques   
DirectFET™ ISOMETRIC  
SJ  
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)  
SH  
SJ  
SP  
MZ  
MN  
Description  
The IRF6645PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the  
lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET package is compatible with  
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,  
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling  
to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.  
The IRF6645PbF is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom  
applications (36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device  
coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability  
improvements, and makes this device ideal for high performance isolated DC-DC converters.  
Absolute Maximum Ratings  
Max.  
100  
±20  
5.7  
4.5  
25  
Parameter  
Units  
V
VDS  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
I
@ TA = 25°C  
D
D
D
A
@ TA = 70°C  
@ TC = 25°C  
45  
DM  
29  
EAS  
IAR  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
3.4  
12  
10  
8
80  
70  
60  
50  
40  
30  
20  
I = 3.4A  
V
= 80V  
I
= 3.4A  
D
DS  
D
VDS= 50V  
T
T
= 125°C  
J
6
4
= 25°C  
14  
J
2
0
4
6
8
10  
12  
16  
0
4
8
12  
16  
V
, Gate-to-Source Voltage (V)  
Q
Total Gate Charge (nC)  
GS  
G
Fig 1. Typical On-Resistance vs. Gate Voltage  
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage  
Notes:  
„ TC measured with thermocouple mounted to top (Drain) of part.  
Repetitive rating; pulse width limited by max. junction temperature.  
† Starting TJ = 25°C, L = 5.0mH, RG = 25Ω, IAS = 3.4A.  
 Click on this section to link to the appropriate technical paper.  
‚ Click on this section to link to the DirectFET Website.  
ƒ Surface mounted on 1 in. square Cu board, steady state.  
1
www.irf.com  
© 2012 International Rectifier  
February 26, 2013  

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