IRF6645PbF
IRF6645TRPbF
DirectFET Power MOSFET
Typical values (unless otherwise specified)
l RoHS Compliant, Halogen-Free
l Lead-Free (Qualified up to 260°C Reflow)
l Application Specific MOSFETs
VDSS
VGS
RDS(on)
28mΩ@ 10V
Vgs(th)
100V max ±20V max
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
l Low Conduction Losses
Qg tot
Qgd
14nC
4.8nC
4.0V
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible
l Compatible with existing Surface Mount Techniques
DirectFET ISOMETRIC
SJ
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
SH
SJ
SP
MZ
MN
Description
The IRF6645PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the
lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling
to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6645PbF is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom
applications (36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device
coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance isolated DC-DC converters.
Absolute Maximum Ratings
Max.
100
±20
5.7
4.5
25
Parameter
Units
V
VDS
Drain-to-Source Voltage
Gate-to-Source Voltage
V
GS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
I
@ TA = 25°C
D
D
D
A
@ TA = 70°C
@ TC = 25°C
45
DM
29
EAS
IAR
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
3.4
12
10
8
80
70
60
50
40
30
20
I = 3.4A
V
= 80V
I
= 3.4A
D
DS
D
VDS= 50V
T
T
= 125°C
J
6
4
= 25°C
14
J
2
0
4
6
8
10
12
16
0
4
8
12
16
V
, Gate-to-Source Voltage (V)
Q
Total Gate Charge (nC)
GS
G
Fig 1. Typical On-Resistance vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
Notes:
TC measured with thermocouple mounted to top (Drain) of part.
ꢀ Repetitive rating; pulse width limited by max. junction temperature.
Starting TJ = 25°C, L = 5.0mH, RG = 25Ω, IAS = 3.4A.
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
1
www.irf.com
© 2012 International Rectifier
February 26, 2013