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FQB34N20TM_AM002 PDF预览

FQB34N20TM_AM002

更新时间: 2024-11-01 20:05:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关脉冲晶体管
页数 文件大小 规格书
8页 1006K
描述
Power Field-Effect Transistor, 31A I(D), 200V, 0.075ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, ROHS COMPLIANT, D2PAK-3

FQB34N20TM_AM002 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:7.6
雪崩能效等级(Eas):640 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):31 A最大漏极电流 (ID):31 A
最大漏源导通电阻:0.075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):245
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):180 W
最大脉冲漏极电流 (IDM):124 A认证状态:Not Qualified
子类别:FET General Purpose Powers表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FQB34N20TM_AM002 数据手册

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October 2013  
FQB34N20  
N-Channel QFET® MOSFET  
200 V, 31 A, 75 mΩ  
Features  
Description  
This N-Channel enhancement mode power MOSFET is  
produced using Fairchild Semiconductor’s proprietary  
planar stripe and DMOS technology. This advanced  
MOSFET technology has been especially tailored to  
reduce on-state resistance, and to provide superior  
switching performance and high avalanche energy  
strength. These devices are suitable for switched mode  
power supplies, active power factor correction (PFC), and  
electronic lamp ballasts.  
31 A, 200 V, RDS(on) = 75 mΩ (Max.) @ VGS = 10 V,  
ID = 15.5 A  
• Low Gate Charge (Typ. 60 nC)  
• Low Crss (Typ. 55 pF)  
• 100% Avalanche Tested  
• RoHS Compliant  
D
D
G
G
D2-PAK  
S
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Thermal Characteristics  
Symbol  
Parameter  
FQB34N20TM_AM002 Unit  
0.7  
RJC  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max.  
62.5  
40  
oC/W  
RJA  
Thermal Resistance, Junction to Ambient (* 1 in2 pad of 2 oz copper), Max.  
©2003 Fairchild Semiconductor Corporation  
FQB34N20 Rev. C1  
1
www.fairchildsemi.com  

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