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FDP51N25 PDF预览

FDP51N25

更新时间: 2024-11-05 22:40:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 659K
描述
250V N-Channel MOSFET

FDP51N25 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:4.45
其他特性:FAST SWITCHING雪崩能效等级(Eas):1111 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):51 A最大漏极电流 (ID):51 A
最大漏源导通电阻:0.06 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):320 W最大脉冲漏极电流 (IDM):204 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP51N25 数据手册

 浏览型号FDP51N25的Datasheet PDF文件第2页浏览型号FDP51N25的Datasheet PDF文件第3页浏览型号FDP51N25的Datasheet PDF文件第4页浏览型号FDP51N25的Datasheet PDF文件第5页浏览型号FDP51N25的Datasheet PDF文件第6页浏览型号FDP51N25的Datasheet PDF文件第7页 
September 2005  
TM  
UniFET  
FDP51N25  
250V N-Channel MOSFET  
Features  
Description  
51A, 250V, R  
= 0.060@V = 10 V  
These N-Channel enhancement mode power field effect transis-  
tors are produced using Fairchild’s proprietary, planar stripe,  
DMOS technology.  
DS(on)  
GS  
Low gate charge ( typical 55 nC)  
Low C ( typical 63 pF)  
rss  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high effi-  
cient switched mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
{
z
ꢀ ꢁ  
z
z
G {  
TO-220  
FQP Series  
{
S
G
D S  
Absolute Maximum Ratings  
Symbol  
Parameter  
FDP51N25  
Unit  
V
I
Drain-Source Voltage  
Drain Current  
250  
V
DSS  
- Continuous (T = 25°C)  
51  
30  
A
A
D
C
- Continuous (T = 100°C)  
C
(Note 1)  
(Note 2)  
I
Drain Current  
- Pulsed  
204  
30  
A
V
DM  
V
Gate-Source voltage  
GSS  
AS  
E
Single Pulsed Avalanche Energy  
Avalanche Current  
1111  
51  
mJ  
A
I
(Note 1)  
(Note 1)  
(Note 3)  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
32  
mJ  
V/ns  
AR  
dv/dt  
4.5  
P
Power Dissipation  
(T = 25°C)  
320  
W
D
C
- Derate above 25°C  
2.56  
W/°C  
T
T
T
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
J, STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
L
°C  
Thermal Characteristics  
Symbol  
Parameter  
Min.  
Max.  
0.39  
--  
Unit  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
--  
0.5  
--  
θJC  
θCS  
θJA  
Thermal Resistance, Junction-to-Ambient  
62.5  
©2005 Fairchild Semiconductor Corporation  
FDP51N25 Rev. A  
1
www.fairchildsemi.com  

FDP51N25 替代型号

型号 品牌 替代类型 描述 数据表
STP50NF25 STMICROELECTRONICS

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