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FDP44N25 PDF预览

FDP44N25

更新时间: 2024-11-09 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 479K
描述
250V N-Channel MOSFET

FDP44N25 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220AB包装说明:LEAD FREE, TO-220, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.84
Is Samacsys:N雪崩能效等级(Eas):2055 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):44 A最大漏极电流 (ID):44 A
最大漏源导通电阻:0.069 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):307 W最大脉冲漏极电流 (IDM):176 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDP44N25 数据手册

 浏览型号FDP44N25的Datasheet PDF文件第2页浏览型号FDP44N25的Datasheet PDF文件第3页浏览型号FDP44N25的Datasheet PDF文件第4页浏览型号FDP44N25的Datasheet PDF文件第5页浏览型号FDP44N25的Datasheet PDF文件第6页浏览型号FDP44N25的Datasheet PDF文件第7页 
April 2007  
TM  
UniFET  
FDP44N25 / FDPF44N25  
250V N-Channel MOSFET  
Features  
Description  
44A, 250V, RDS(on) = 0.069Ω @VGS = 10 V  
Low gate charge ( typical 47 nC)  
Low Crss ( typical 60 pF)  
Fast switching  
Improved dv/dt capability  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D  
S
G
D S  
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FDP44N25 FDPF44N25  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
250  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
44  
26.4  
44*  
26.4*  
A
A
(Note 1)  
IDM  
Drain Current  
- Pulsed  
A
176  
176*  
VGSS  
EAS  
IAR  
Gate-Source voltage  
± 30  
2055  
44  
V
mJ  
A
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
30.7  
4.5  
mJ  
V/ns  
Power Dissipation  
(TC = 25°C)  
307  
38  
W
- Derate above 25°C  
2.45  
0.3  
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
FDP44N25 FDPF44N25  
Unit  
°C/W  
°C/W  
°C/W  
RθJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.41  
0.5  
3.3  
--  
RθCS  
RθJA  
62.5  
62.5  
©2007 Fairchild Semiconductor Corporation  
FDP44N25 / FDPF44N25 Rev. B  
1
www.fairchildsemi.com  

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