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SSM3J01F(TE85L,F) PDF预览

SSM3J01F(TE85L,F)

更新时间: 2024-11-24 21:21:51
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 332K
描述
SSM3J01F(TE85L,F)

SSM3J01F(TE85L,F) 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.83Base Number Matches:1

SSM3J01F(TE85L,F) 数据手册

 浏览型号SSM3J01F(TE85L,F)的Datasheet PDF文件第2页浏览型号SSM3J01F(TE85L,F)的Datasheet PDF文件第3页浏览型号SSM3J01F(TE85L,F)的Datasheet PDF文件第4页浏览型号SSM3J01F(TE85L,F)的Datasheet PDF文件第5页 
SSM3J01F  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM3J01F  
High Speed Switching Applications  
Unit: mm  
Small package  
Low on resistance: Ron = 0.4 (max) (V  
= 4 V)  
GS  
GS  
: Ron = 0.6 (max) (V  
= 2.5 V)  
Low gate threshold voltage  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
30  
±10  
V
V
DS  
Gate-source voltage  
V
GSS  
DC  
I
700  
1400  
200  
D
Drain current  
mA  
Pulse  
I
DP  
Drain power dissipation (Ta = 25°C)  
Channel temperature  
P
mW  
°C  
D
ch  
stg  
T
150  
Storage temperature range  
T
55~150  
°C  
JEDEC  
JEITA  
TO-236MOD  
SC-59  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
TOSHIBA  
2-3F1F  
Weight: 0.012 g (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Marking  
Equivalent Circuit  
Handling Precaution  
When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment  
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  

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