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NTR4171PT1G PDF预览

NTR4171PT1G

更新时间: 2024-05-23 22:21:30
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
6页 439K
描述
种类:P-Channel;漏源电压(Vdss):-30V;持续漏极电流(Id)(在25°C时):-2.2 A;Vgs(th)(V):±12;漏源导通电阻:75mΩ@-10V

NTR4171PT1G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT-23包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:0.67配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):2.2 A
最大漏极电流 (ID):2.2 A最大漏源导通电阻:0.075 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-236AB
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.25 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTR4171PT1G 数据手册

 浏览型号NTR4171PT1G的Datasheet PDF文件第2页浏览型号NTR4171PT1G的Datasheet PDF文件第3页浏览型号NTR4171PT1G的Datasheet PDF文件第4页浏览型号NTR4171PT1G的Datasheet PDF文件第5页浏览型号NTR4171PT1G的Datasheet PDF文件第6页 
R
NTR4171  
UMW  
PCHANNEL MOSFET  
Features  
VDS (V) = -30V  
SOT23  
RDS(ON)  
RDS(ON)  
75m  
110m  
(VGS  
= -10V)  
(VGS = -4.5V)  
Applications  
Load Switch  
Optimized for Battery and Load Management Applications in  
Portable Equipment like Cell Phones, PDA’s, Media Players, etc.  
1. GATE  
2. SOURCE  
3. DRAIN  
S
G
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
12  
V
Continuous Drain  
Current (Note 1)  
T = 25°C  
2.2  
1.5  
3.5  
0.48  
A
Steady  
State  
State  
T = 85°C  
A
I
A
D
t 5 s  
Steady  
t 5 s  
T = 25°C  
A
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
W
D
1.25  
Pulsed Drain Current  
t = 10 ms  
p
I
15.0  
A
DM  
Operating Junction and Storage Temperature  
T ,  
T
stg  
55 to  
150  
J
°C  
Source Current (Body Diode)  
I
S
1.0  
A
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device  
functionality should not be assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
260  
100  
Unit  
JunctiontoAmbient Steady State (Note 1)  
JunctiontoAmbient t 10 s (Note 1)  
R
°C/W  
q
JA  
R
q
JA  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces)  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  
 

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