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NTR4503NT1G PDF预览

NTR4503NT1G

更新时间: 2024-12-01 17:15:55
品牌 Logo 应用领域
友台半导体 - UMW /
页数 文件大小 规格书
5页 349K
描述
种类:N-Channel;漏源电压(Vdss):30V;持续漏极电流(Id)(在25°C时):2.5 A;Vgs(th)(V):±20;漏源导通电阻:110mΩ@10V;漏源导通电阻:140mΩ@4.5V

NTR4503NT1G 数据手册

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R
UMW  
NTR4503  
N-Channel 30 V (D-S) MOSFET  
MOSFET PRODUCT SUMMARY  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
SOT23  
85 mW @ 10 V  
30 V  
2.5 A  
105 mW @ 4.5 V  
1. GATE  
Features  
2. SOURCE  
3. DRAIN  
Leading Planar Technology for Low Gate Charge / Fast Switching  
4.5 V Rated for Low Voltage Gate Drive  
These Devices are PbFree and are RoHS Compliant  
N−Channel  
D
Applications  
DCDC Conversion  
Load/Power Switch for Portables  
Load/Power Switch for Computing  
G
S
MAXIMUM RATINGS  
(T = 25  
J
unless otherwise noted)  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
Gate−to−Source Voltage  
V
GS  
20  
V
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
D
2.0  
1.5  
A
A
State  
T = 85°C  
A
t 10 s T = 25°C  
2.5  
A
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
0.73  
W
A
A
D
State  
Continuous Drain  
Current (Note 2)  
Steady T = 25°C  
I
D
1.5  
1.1  
A
State  
T = 85°C  
A
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
D
0.42  
W
Pulsed Drain Current  
t = 10 ms  
p
I
10  
A
DM  
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
T
stg  
Source Current (Body Diode)  
I
2.0  
4.0  
A
A
S
Peak Source Current  
(Diode Forward)  
t = 10 ms  
p
I
SM  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device  
functionality should not be assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
170  
100  
300  
Unit  
Junction−to−Ambient − Steady State (Note 1)  
Junction−to−Ambient − t < 10 s (Note 1)  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
q
q
JA  
JA  
JA  
R
R
1. Surface−mounted on FR4 board using 1 in sq pad size.  
2. Surface−mounted on FR4 board using the minimum recommended pad size.  
www.umw-ic.com  
1
UTD Semiconductor Co.,Limited  
 

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