NTR4502P
Power MOSFET
−30 V, −1.95 A, Single, P−Channel,
SOT−23
Features
http://onsemi.com
• Leading Planar Technology for Low Gate Charge / Fast Switching
V
R
TYP
I
D
Max (Note 1)
−1.95 A
(BR)DSS
DS(on)
• Low R
for Low Conduction Losses
DS(ON)
155 mW @ −10 V
240 mW @ −4.5 V
• SOT−23 Surface Mount for Small Footprint (3 X 3 mm)
• Pb−Free Packages are Available
−30 V
Applications
• DC to DC Conversion
P−Channel MOSFET
S
• Load/Power Switch for Portables and Computing
• Motherboard, Notebooks, Camcorders, Digital Camera’s, etc.
• Battery Charging Circuits
G
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol Value Unit
D
V
−30
20
V
V
A
DSS
Gate−to−Source Voltage
V
GS
MARKING DIAGRAM/
PIN ASSIGNMENT
Drain Current (Note 1)
t < 10 s T = 25°C
I
D
−1.95
−1.56
1.25
A
Drain
3
T = 70°C
A
Power Dissipation
(Note 1)
t < 10 s
P
W
A
D
TR2 M G
G
SOT−23
CASE 318
STYLE 21
Continuous Drain Current Steady T = 25°C
I
D
−1.13
−0.90
0.4
A
2
1
Gate
(Note 1)
State
Steady State
t = 10 ms
T = 70°C
A
Source
Power Dissipation
(Note 1)
P
W
D
TR2 = Device Code
M
G
= Date Code*
= Pb−Free Package
Pulsed Drain Current
I
−6.8
A
p
DM
(Note: Microdot may be in either location)
Operating Junction and Storage Temperature
T ,
STG
−55 to
150
°C
J
T
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Source Current (Body Diode)
I
S
−1.25
A
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
Device
Package
Shipping†
THERMAL RESISTANCE RATINGS
Parameter
NTR4502PT1
SOT−23
3000 / Tape & Reel
Symbol
Max
300
100
Unit
NTR4502PT1G
SOT−23
(Pb−Free)
3000 / Tape & Reel
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t = 10 s (Note 1)
R
°C/W
q
JA
R
q
JA
NTR4502PT3
SOT−23
10000 / Tape & Reel
10000 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq. pad size
NTR4502PT3G
SOT−23
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(Cu area = 1.127 in sq. [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
April, 2009 − Rev. 4
NTR4502P/D