NTR4503N
Power MOSFET
30 V, 2.5 A, Single N−Channel, SOT−23
Features
• Leading Planar Technology for Low Gate Charge / Fast Switching
• 4.5 V Rated for Low Voltage Gate Drive
• SOT−23 Surface Mount for Small Footprint (3 x 3 mm)
• Pb−Free Package is Available
http://onsemi.com
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
Applications
85 mW @ 10 V
• DC−DC Conversion
• Load/Power Switch for Portables
• Load/Power Switch for Computing
30 V
2.5 A
105 mW @ 4.5 V
N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
D
V
30
±20
2.0
DSS
Gate−to−Source Voltage
V
V
GS
Continuous Drain
Current (Note 1)
Steady T = 25°C
State
I
D
A
A
G
T = 85°C
A
1.5
t ≤ 10 s T = 25°C
2.5
A
S
Power Dissipation
(Note 1)
Steady T = 25°C
State
P
0.73
W
A
A
D
MARKING DIAGRAM/
PIN ASSIGNMENT
Continuous Drain
Current (Note 2)
Steady T = 25°C
I
D
1.5
1.1
A
State
T = 85°C
A
3
3
Power Dissipation
(Note 2)
T = 25°C
A
P
D
0.42
W
Drain
1
Pulsed Drain Current
t = 10 ms
I
6.0
A
V
2
p
DM
TR3
ESD Capability (Note 3)
C = 100 pF,
RS = 1500 W
ESD
125
SOT−23
CASE 318
STYLE 21
1
Gate
2
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
Source
T
stg
Source Current (Body Diode)
I
2.0
A
TR3 = Specific Device Code
= Date Code
S
M
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
ORDERING INFORMATION
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†
Device
Package
Shipping
NTR4503NT1
SOT−23
3000/Tape & Reel
THERMAL RESISTANCE RATINGS
SOT−23
(Pb−Free)
NTR4503NT1G
3000/Tape & Reel
10000/Tape & Reel
Parameter
Symbol
Max
170
100
300
Unit
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t < 10 s (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
q
q
JA
JA
JA
SOT−23
(Pb−Free)
NTR4503NT3G
R
R
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surface−mounted on FR4 board using 1 in sq pad size.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
3. ESD Rating Information: HBM Class 0.
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
March, 2005 − Rev. 3
NTR4503N/D