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NTR4503NT1G PDF预览

NTR4503NT1G

更新时间: 2024-11-30 02:59:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 59K
描述
Power MOSFET 30 V, 2.5 A, Single N−Channel, SOT−23

NTR4503NT1G 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:SOT-23包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:0.57
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):1.5 A最大漏极电流 (ID):1.5 A
最大漏源导通电阻:0.11 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):25 pFJEDEC-95代码:TO-236
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):0.73 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTR4503NT1G 数据手册

 浏览型号NTR4503NT1G的Datasheet PDF文件第2页浏览型号NTR4503NT1G的Datasheet PDF文件第3页浏览型号NTR4503NT1G的Datasheet PDF文件第4页浏览型号NTR4503NT1G的Datasheet PDF文件第5页浏览型号NTR4503NT1G的Datasheet PDF文件第6页 
NTR4503N  
Power MOSFET  
30 V, 2.5 A, Single N−Channel, SOT−23  
Features  
Leading Planar Technology for Low Gate Charge / Fast Switching  
4.5 V Rated for Low Voltage Gate Drive  
SOT−23 Surface Mount for Small Footprint (3 x 3 mm)  
Pb−Free Package is Available  
http://onsemi.com  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Applications  
85 mW @ 10 V  
DC−DC Conversion  
Load/Power Switch for Portables  
Load/Power Switch for Computing  
30 V  
2.5 A  
105 mW @ 4.5 V  
N−Channel  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value  
Unit  
V
D
V
30  
±20  
2.0  
DSS  
Gate−to−Source Voltage  
V
V
GS  
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
State  
I
D
A
A
G
T = 85°C  
A
1.5  
t 10 s T = 25°C  
2.5  
A
S
Power Dissipation  
(Note 1)  
Steady T = 25°C  
State  
P
0.73  
W
A
A
D
MARKING DIAGRAM/  
PIN ASSIGNMENT  
Continuous Drain  
Current (Note 2)  
Steady T = 25°C  
I
D
1.5  
1.1  
A
State  
T = 85°C  
A
3
3
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
D
0.42  
W
Drain  
1
Pulsed Drain Current  
t = 10 ms  
I
6.0  
A
V
2
p
DM  
TR3  
ESD Capability (Note 3)  
C = 100 pF,  
RS = 1500 W  
ESD  
125  
SOT−23  
CASE 318  
STYLE 21  
1
Gate  
2
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
Source  
T
stg  
Source Current (Body Diode)  
I
2.0  
A
TR3 = Specific Device Code  
= Date Code  
S
M
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
ORDERING INFORMATION  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Device  
Package  
Shipping  
NTR4503NT1  
SOT−23  
3000/Tape & Reel  
THERMAL RESISTANCE RATINGS  
SOT−23  
(Pb−Free)  
NTR4503NT1G  
3000/Tape & Reel  
10000/Tape & Reel  
Parameter  
Symbol  
Max  
170  
100  
300  
Unit  
Junction−to−Ambient − Steady State (Note 1)  
Junction−to−Ambient − t < 10 s (Note 1)  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
q
q
JA  
JA  
JA  
SOT−23  
(Pb−Free)  
NTR4503NT3G  
R
R
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surface−mounted on FR4 board using 1 in sq pad size.  
2. Surface−mounted on FR4 board using the minimum recommended pad size.  
3. ESD Rating Information: HBM Class 0.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
March, 2005 − Rev. 3  
NTR4503N/D  
 

NTR4503NT1G 替代型号

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