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NTR4171PT3G PDF预览

NTR4171PT3G

更新时间: 2024-01-22 12:10:03
品牌 Logo 应用领域
TYSEMI /
页数 文件大小 规格书
2页 181K
描述
Power MOSFET -30 V, -3.5 A, Single P-Channel, SOT-23

NTR4171PT3G 技术参数

是否无铅: 不含铅生命周期:End Of Life
零件包装代码:SOT-23包装说明:LEAD FREE, CASE 318-08, TO-236, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.2
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:30 V
最大漏极电流 (Abs) (ID):2.2 A最大漏极电流 (ID):2.2 A
最大漏源导通电阻:0.075 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.25 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTR4171PT3G 数据手册

 浏览型号NTR4171PT3G的Datasheet PDF文件第2页 
Product specification  
NTR4171P  
Power MOSFET  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
30 V, 3.5 A, Single PChannel, SOT23  
75 mW @ 10 V  
110 mW @ 4.5 V  
150 mW @ 2.5 V  
2.2 A  
1.8 A  
1.0 A  
30 V  
Features  
Low R  
at Low Gate Voltage  
Low Threshold Voltage  
DS(on)  
High Power and Current Handling Capability  
This is a PbFree Device  
PCHANNEL MOSFET  
S
Applications  
Load Switch  
Optimized for Battery and Load Management Applications in  
G
Portable Equipment like Cell Phones, PDA’s, Media Players, etc.  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol Value  
Unit  
V
MARKING DIAGRAM/  
PIN ASSIGNMENT  
V
30  
12  
DSS  
3
GatetoSource Voltage  
V
V
GS  
3
Continuous Drain  
Current (Note 1)  
T = 25°C  
2.2  
1.5  
3.5  
0.48  
Drain  
A
Steady  
State  
1
T = 85°C  
A
I
D
A
2
TRFMG  
SOT23  
t 5 s  
T = 25°C  
A
G
CASE 318  
STYLE 21  
Power Dissipation  
(Note 1)  
Steady  
State  
1
Gate  
2
T = 25°C  
A
P
D
W
Source  
t 5 s  
1.25  
TRF  
M
= Specific Device Code  
= Date Code  
Pulsed Drain Current  
t = 10 ms  
p
I
15.0  
A
DM  
G
= PbFree Package  
(Note: Microdot may be in either location)  
Operating Junction and Storage Temperature  
T ,  
T
stg  
55 to  
150  
J
°C  
Source Current (Body Diode)  
I
S
1.0  
A
Lead Temperature for Soldering Purposes  
T
260  
°C  
ORDERING INFORMATION  
L
(1/8from case for 10 s)  
Device  
Package  
Shipping  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
NTR4171PT1G  
SOT23  
3000/Tape & Reel  
(PbFree)  
NTR4171PT3G  
SOT23  
(PbFree)  
10000/Tape & Reel  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
260  
100  
Unit  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
JunctiontoAmbient Steady State (Note 1)  
JunctiontoAmbient t 10 s (Note 1)  
R
°C/W  
q
JA  
R
q
JA  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[2 oz] including traces)  
http://www.twtysemi.com  
sales@twtysemi.com  
1 of 2  
 

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