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NTR4502P PDF预览

NTR4502P

更新时间: 2024-02-01 19:19:38
品牌 Logo 应用领域
TYSEMI 电池
页数 文件大小 规格书
2页 188K
描述
Power MOSFET -30 V, -1.95 A, Single, P-Channel, SOT-23 Battery Charging Circuits

NTR4502P 数据手册

 浏览型号NTR4502P的Datasheet PDF文件第2页 
Product specification  
NTR4502P, NVTR4502P  
Power MOSFET  
V
R
TYP  
I
D
Max (Note 1)  
1.95 A  
(BR)DSS  
DS(on)  
155 mW @ 10 V  
240 mW @ 4.5 V  
30 V, 1.95 A, Single, PChannel,  
SOT23  
30 V  
PChannel MOSFET  
Features  
S
Leading Planar Technology for Low Gate Charge / Fast Switching  
Low R  
for Low Conduction Losses  
DS(ON)  
G
SOT23 Surface Mount for Small Footprint (3 X 3 mm)  
AEC Q101 Qualified NVTR4502P  
These Devices are PbFree and are RoHS Compliant  
Applications  
DC to DC Conversion  
D
Load/Power Switch for Portables and Computing  
Motherboard, Notebooks, Camcorders, Digital Camera’s, etc.  
Battery Charging Circuits  
MARKING DIAGRAM/  
PIN ASSIGNMENT  
Drain  
3
TR2 M G  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
G
SOT23  
CASE 318  
STYLE 21  
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
2
1
Gate  
Source  
V
DSS  
30  
20  
V
V
A
GatetoSource Voltage  
V
GS  
TR2 = Device Code  
M
G
= Date Code*  
Drain Current (Note 1)  
t < 10 s T = 25°C  
I
D
1.95  
1.56  
1.25  
A
= PbFree Package  
T = 70°C  
A
(Note: Microdot may be in either location)  
Power Dissipation  
(Note 1)  
t < 10 s  
P
D
W
A
*Date Code orientation and/or overbar may  
vary depending upon manufacturing location.  
Continuous Drain Current Steady T = 25°C  
I
1.13  
0.90  
0.4  
A
D
(Note 1)  
State  
Steady State  
t = 10 ms  
ORDERING INFORMATION  
T = 70°C  
A
Power Dissipation  
(Note 1)  
P
W
Device  
Package  
Shipping†  
D
NTR4502PT1G  
SOT23  
3000 / Tape & Reel  
Pulsed Drain Current  
I
6.8  
A
(PbFree)  
p
DM  
Operating Junction and Storage Temperature  
T ,  
STG  
55 to  
°C  
J
NVTR4502PT1G  
SOT23  
(PbFree)  
3000 / Tape & Reel  
T
150  
Source Current (Body Diode)  
I
S
1.25  
A
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Lead Temperature for Soldering Purposes  
(1/8 in from case for 10 s)  
T
L
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
300  
100  
Unit  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t = 10 s (Note 1)  
R
°C/W  
q
JA  
R
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 in sq. pad size  
(Cu area = 1.127 in sq. [1 oz] including traces).  
http://www.twtysemi.com  
sales@twtysemi.com  
1 of 2  
 

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