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NTD5407N

更新时间： 2024-11-05 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 68K
描述
Power MOSFET 40 V, 38 A, Single N−Channel, DPAK

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NTD5407N 数据手册

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NTD5407N  
Power MOSFET  
40 V, 38 A, Single N−Channel, DPAK  
Features  
• Low R  
DS(on)  
• High Current Capability  
• Low Gate Charge  
http://onsemi.com  
• These are Pb−Free Devices  
I
D
MAX  
V
R
TYP  
DS(ON)  
(Note 1)  
(BR)DSS  
Applications  
40 V  
21 mΩ @ 10 V  
38 A  
• Electronic Brake Systems  
• Electronic Power Steering  
• Bridge Circuits  
N−Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
V
DSS  
40  
20  
38  
27  
75  
V
V
A
G
Gate−to−Source Voltage  
Continuous Drain  
V
GS  
I
D
T
= 25°C  
C
Steady  
State  
S
Current −R  
(Note 1)  
ꢀ
JC  
T
C
= 100°C  
Power Dissipation −  
(Note 1)  
Steady  
State  
P
D
W
T
C
= 25°C  
R
MARKING  
DIAGRAM  
ꢀ
JC  
4
Pulsed Drain Current  
t = 10 ꢁ s  
p
I
75  
A
DM  
1
Operating Junction and Storage Temperature  
T ,  
−55 to  
175  
°C  
J
2
1
T
STG  
YWW  
54  
07NG  
3
Source Current (Body Diode)  
I
36  
A
S
DPAK  
CASE 369C  
STYLE 2  
Single Pulse Drain−to Source Avalanche  
EAS  
150  
mJ  
Energy − (V = 50 V, V = 10 V, I = 17 A,  
DD  
GS  
PK  
L = 1 mH, R = 25 ꢂ)  
G
Y
= Year  
= Work Week  
= Specific Device Code  
= Pb−Free Device  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
260  
°C  
T
L
WW  
5407N  
G
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
THERMAL RESISTANCE RATINGS (Note 1)  
Device  
Package  
Shipping†  
Parameter  
Junction−to−Case (Drain)  
Symbol  
Max  
Units  
NTD5407NG  
DPAK  
(Pb−Free)  
75 Units / Rail  
R
2.0  
°C/W  
θ
JC  
NTD5407NT4G  
DPAK  
(Pb−Free)  
2500 / Tape & Reel  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
October, 2005 − Rev. 0  
NTD5407N/D  
 
123456

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