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NTD5803NT4G

更新时间: 2024-11-18 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 106K
描述
Power MOSFET 40 V, 76 A, Single N−Channel, DPAK

NTD5803NT4G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:LEAD FREE, CASE 369AA-01, DPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.34雪崩能效等级(Eas):240 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:40 V最大漏极电流 (Abs) (ID):76 A
最大漏极电流 (ID):76 A最大漏源导通电阻:0.0072 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):83 W
最大脉冲漏极电流 (IDM):228 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTD5803NT4G 数据手册

 浏览型号NTD5803NT4G的Datasheet PDF文件第2页浏览型号NTD5803NT4G的Datasheet PDF文件第3页浏览型号NTD5803NT4G的Datasheet PDF文件第4页浏览型号NTD5803NT4G的Datasheet PDF文件第5页浏览型号NTD5803NT4G的Datasheet PDF文件第6页 
NTD5803N  
Power MOSFET  
40 V, 76 A, Single NChannel, DPAK  
Features  
Low R  
DS(on)  
High Current Capability  
Avalanche Energy Specified  
These are PbFree Devices  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Applications  
10.1 mW @ 5.0 V  
7.2 mW @ 10 V  
54 A  
76 A  
40 V  
CCFL Backlight  
DC Motor Control  
Class D Amplifier  
D
Power Supply Secondary Side Synchronous Rectification  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
G
V
DSS  
GatetoSource Voltage Continuous  
GatetoSource Voltage  
V
"20  
"30  
V
GS  
S
NCHANNEL MOSFET  
V
GS  
V
NonRepetitive (t < 10 mS)  
p
4
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
I
76  
54  
83  
A
C
D
4
Current (R  
(Note 1)  
)
q
JC  
Steady  
State  
T
C
2
1
Power Dissipation  
(R ) (Note 1)  
T
C
P
W
D
3
1
q
JC  
2
3
DPAK  
Pulsed Drain Current  
t = 10 ms  
I
228  
A
p
DM  
DPAK  
CASE 369C  
(Surface Mount)  
STYLE 2  
CASE 369D  
(Straight Lead)  
STYLE 2  
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Source Current (Body Diode)  
I
76  
A
S
Single Pulse DraintoSource Avalanche  
E
240  
mJ  
AS  
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
Energy (V = 50 V, V = 10 V, R = 25 W,  
DD  
GS  
G
I
= 40 A, L = 0.3 mH)  
L(pk)  
4
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
Drain  
L
4
Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
THERMAL RESISTANCE MAXIMUM RATINGS  
2
Drain  
1
3
Parameter  
Symbol  
Value  
Unit  
Gate Source  
1
2
3
JunctiontoCase (Drain)  
R
1.8  
64  
°C/W  
q
JC  
Gate Drain Source  
JunctiontoAmbient Steady State (Note 1)  
R
q
JA  
Y
WW  
= Year  
= Work Week  
5803N = Device Code  
1. Surfacemounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces.  
G
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
December, 2008 Rev. 0  
NTD5803N/D  
 

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