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NTD5865

更新时间: 2024-11-19 01:20:39
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安森美 - ONSEMI /
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7页 108K
描述
N-Channel Power MOSFET

NTD5865 数据手册

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NTD5865NL  
N-Channel Power MOSFET  
60 V, 46 A, 16 mW  
Features  
Low Gate Charge  
Fast Switching  
http://onsemi.com  
High Current Capability  
100% Avalanche Tested  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
These Devices are Pb−Free, Halogen Free and are RoHS Compliant  
16 mW @ 10 V  
19 mW @ 4.5 V  
60 V  
46 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
D
V
DSS  
Gate−to−Source Voltage − Continuous  
V
20  
V
GS  
GS  
N−Channel  
Gate−to−Source Voltage  
V
30  
V
− Non−Repetitive (t < 10 ms)  
G
p
Continuous Drain  
Current (R  
T
= 25°C  
= 100°C  
= 25°C  
I
46  
33  
71  
A
C
D
)
q
JC  
S
Steady  
State  
T
C
4
Power Dissipation  
(R  
T
C
P
W
D
)
q
JC  
4
Pulsed Drain Current  
t = 10 ms  
p
I
203  
A
DM  
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
1
2
1
2
3
3
Source Current (Body Diode)  
I
46  
36  
A
mJ  
A
S
DPAK  
IPAK  
Single Pulse Drain−to−Source  
Avalanche Energy  
(L =  
0.1 mH)  
E
CASE 369AA  
(Surface Mount)  
STYLE 2  
CASE 369D  
(Straight Lead)  
STYLE 2  
AS  
AS  
I
27  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
4
Drain  
4
THERMAL RESISTANCE MAXIMUM RATINGS  
Drain  
Parameter  
Symbol  
Value  
Unit  
Junction−to−Case (Drain)  
R
2.1  
49  
°C/W  
q
q
JC  
Junction−to−Ambient − Steady State (Note 1)  
R
JA  
2
1. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
2
Drain  
1
3
1
2
3
Gate Source  
Gate Drain Source  
A
Y
WW  
= Assembly Location*  
= Year  
= Work Week  
5865NL = Device Code  
= Pb−Free Package  
G
* The Assembly Location code (A) is front side  
optional. In cases where the Assembly Location is  
stamped in the package, the front side assembly  
code may be blank.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 4  
NTD5865NL/D  
 

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