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NTD5N50/D

更新时间： 2024-02-06 02:27:08
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
4页 43K
描述
Power MOSFET 5 Amps， 500 Volts

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中文翻译

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NTD5N50/D 数据手册

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NTD5N50  
Preferred Device  
Advance Information  
Power MOSFET  
5 Amps, 500 Volts  
N–Channel DPAK  
Designed for high voltage, high speed switching applications in  
power supplies, converters, power motor controls and bridge circuits.  
http://onsemi.com  
Features  
5 AMPERES  
500 VOLTS  
• Higher Current Rating  
• Lower R  
• Lower Capacitances  
DS(on)  
R
= 1700 mΩ  
DS(on)  
• Lower Total Gate Charge  
N–Channel  
• Tighter V Specifications  
SD  
D
• Avalanche Energy Specified  
• Industry Standard DPAK Surface Mount Package  
Typical Applications  
• Switch Mode Power Supplies  
• PWM Motor Controls  
G
• Converters  
S
• Bridge Circuits  
MARKING  
DIAGRAMS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Drain–Source Voltage  
Symbol  
Value  
Unit  
4
YWW  
T
5N50  
CASE 369A  
DPAK  
STYLE 2  
V
V
500  
500  
Vdc  
Vdc  
Vdc  
DSS  
Drain–Gate Voltage (R  
= 1.0 MΩ)  
2
3
GS  
DGR  
1
Gate–Source Voltage  
– Continuous  
V
"20  
"40  
GS  
– Non–Repetitive (t v10 ms)  
Y
WW  
T
= Year  
= Work Week  
= MOSFET  
p
V
GSM  
Drain – Continuous  
– Continuous @ 100°C  
– Single Pulse (t v10 µs)  
I
D
I
D
5.0  
3.4  
18  
Adc  
p
I
DM  
PIN ASSIGNMENT  
Total Power Dissipation  
Derate above 25°C  
Total Power Dissipation @ T = 25°C  
P
D
96  
0.77  
1.75  
Watts  
W/°C  
W/°C  
Drain  
C
when mounted with the minimum  
recommended pad size  
Operating and Storage Temperature  
Range  
T , T  
J stg  
–55 to  
150  
°C  
Single Drain–to–Source Avalanche  
E
AS  
125  
mJ  
Gate  
Source  
Drain  
Energy – Starting T = 25°C  
J
GS  
(V  
= 100 Vdc, V  
= 10 Vdc,  
DD  
I
L
= 5 A, L = 10 mH, R = 25 Ω)  
G
Thermal Resistance  
– Junction–to–Case  
°C/W  
ORDERING INFORMATION  
R
R
R
1.30  
100  
71.4  
θJC  
θJA  
θJA  
– Junction–to–Ambient  
– Junction–to–Ambient (Note 1.)  
Device  
Package  
DPAK  
Shipping  
75 Units/Rail  
NTD5N50  
Maximum Lead Temperature for Soldering  
Purposes, 1/8″ from case for 10 seconds  
T
260  
°C  
L
NTD5N50–1  
NTD5N50T4  
DPAK  
75 Units/Rail  
1. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
DPAK  
2500 Tape & Reel  
This document contains information on a new product. Specifications and information  
herein are subject to change without notice.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
November, 2000 – Rev. 1  
NTD5N50/D  
1234

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