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NTD5C688NLT4G PDF预览

NTD5C688NLT4G

更新时间: 2023-09-03 20:36:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 178K
描述
单 N 沟道,逻辑电平,功率 MOSFET,60V,17A,27.4mΩ

NTD5C688NLT4G 数据手册

 浏览型号NTD5C688NLT4G的Datasheet PDF文件第2页浏览型号NTD5C688NLT4G的Datasheet PDF文件第3页浏览型号NTD5C688NLT4G的Datasheet PDF文件第4页浏览型号NTD5C688NLT4G的Datasheet PDF文件第5页浏览型号NTD5C688NLT4G的Datasheet PDF文件第6页浏览型号NTD5C688NLT4G的Datasheet PDF文件第7页 
NTD5C688NL  
Power MOSFET  
60 V, 27.4 mW, 17 A, Single N−Channel  
Features  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G
www.onsemi.com  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
I
D
(BR)DSS  
DS(on)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
27.4 mW @ 10 V  
40 mW @ 4.5 V  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
60 V  
17 A  
V
DSS  
Gate−to−Source Voltage  
Continuous Drain Cur-  
V
"20  
17  
V
GS  
D
T
= 25°C  
= 100°C  
= 25°C  
I
A
C
D
rent R  
(Notes 1 & 3)  
q
JC  
T
C
12  
Steady  
State  
Power Dissipation R  
(Note 1)  
T
C
P
18  
W
A
q
D
JC  
T
C
= 100°C  
9.1  
7.5  
5.3  
3.4  
1.7  
77  
G
Continuous Drain  
Current R  
T = 25°C  
A
I
D
q
JA  
S
T = 100°C  
A
(Notes 1, 2 & 3)  
Steady  
State  
N−CHANNEL MOSFET  
Power Dissipation R  
(Notes 1 & 2)  
T = 25°C  
A
P
W
q
D
JA  
T = 100°C  
A
4
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
2
1
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
3
DPAK  
CASE 369C  
STYLE 2  
Source Current (Body Diode)  
I
20  
48  
A
S
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy (I  
= 1 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
4
Drain  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
8.3  
Unit  
Junction−to−Case (Drain) (Note 1)  
Junction−to−Ambient − Steady State (Note 2)  
R
°C/W  
q
JC  
JA  
2
R
44  
Drain  
Gate Source  
q
1
3
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
A
Y
WW  
= Assembly Location  
= Year  
= Work Week  
2
5C688L = Device Code  
G
= Pb−Free Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
May, 2018 − Rev. 2  
NTD5C688NL/D  
 

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