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NTD5806N

更新时间: 2024-11-21 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 131K
描述
Power MOSFET 40 V, 33 A, Single N−Channel, DPAK/IPAK

NTD5806N 数据手册

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NTD5806N  
Power MOSFET  
40 V, 33 A, Single NChannel, DPAK/IPAK  
Features  
Low R  
DS(on)  
High Current Capability  
Avalanche Energy Specified  
These are PbFree Devices  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
Applications  
26 mW @ 4.5 V  
19 mW @ 10 V  
40 V  
33 A  
CCFL Backlight  
DC Motor Control  
Power Supply Secondary Side Synchronous Rectification  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
G
GatetoSource Voltage Continuous  
GatetoSource Voltage  
V
"20  
"30  
V
GS  
V
GS  
V
S
NonRepetitive (t < 10 mS)  
p
NCHANNEL MOSFET  
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
I
33  
23  
40  
A
C
D
4
Current (R  
(Note 1)  
)
q
JC  
Steady  
State  
T
C
4
Power Dissipation  
(R ) (Note 1)  
T
C
P
W
D
2
1
q
JC  
3
1
Pulsed Drain Current  
t = 10 ms  
I
67  
A
2
p
DM  
3
DPAK  
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
IPAK  
CASE 369C  
(Surface Mount)  
STYLE 2  
CASE 369D  
(Straight Lead  
DPAK)  
Source Current (Body Diode)  
I
33  
39  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (V = 50 V, V = 10 V, R = 25 W,  
DD  
GS  
G
MARKING DIAGRAMS  
& PIN ASSIGNMENT  
I
= 28 A, L = 0.1 mH, V = 40 V)  
L(pk)  
DS  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
4
Drain  
4
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
Drain  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
2
Drain  
1
3
JunctiontoCase (Drain)  
R
3.7  
°C/W  
q
JC  
Gate Source  
1
2
3
JunctiontoAmbient Steady State (Note 1)  
R
57.5  
q
JA  
Gate Drain Source  
1. Surfacemounted on FR4 board using 1 in sq pad size  
Y
WW  
= Year  
= Work Week  
(Cu area = 1.127 in sq [1 oz] including traces.  
5806N = Device Code  
G
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
February, 2010 Rev. 3  
NTD5806N/D  
 

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