NTD5862N, NTP5862N
N-Channel Power MOSFET
60 V, 98 A, 5.7 mW
Features
• Low R
DS(on)
www.onsemi.com
• High Current Capability
• 100% Avalanche Tested
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
60 V
5.7 mW @ 10 V
98 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
D
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
N−Channel
Gate−to−Source Voltage − Continuous
V
20
V
G
GS
GS
Gate−to−Source Voltage
V
30
V
− Non−Repetitive (t < 10 ms)
S
4
p
Continuous Drain
T
= 25°C
= 100°C
= 25°C
I
98
69
A
4
C
D
Current (R
(Note 1)
)
q
JC
Steady
State
T
C
Power Dissipation
(R
T
C
P
115
W
D
4
)
q
JC
1
2
3
Pulsed Drain Current
t = 10 ms
I
335
A
p
DM
2
1
1
2
3
3
Operating Junction and Storage Temperature
T , T
J
−55 to
175
°C
stg
DPAK
CASE 369C
STYLE 2
IPAK
CASE 369D
STYLE 2
TO−220
CASE 221A
STYLE 5
Source Current (Body Diode)
I
S
96
A
Single Pulse Drain−to−Source Avalanche
Energy (L = 0.3 mH)
E
205
mJ
AS
MARKING DIAGRAMS
& PIN ASSIGNMENT
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
4
Drain
4
4
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
Drain
Drain
THERMAL RESISTANCE MAXIMUM RATINGS
NTP
5862NG
AYWW
Parameter
Symbol
Value
1.3
Unit
2
Junction−to−Case (Drain)
R
°C/W
q
JC
JA
Drain
1
3
1
Gate
3
Gate Source
Junction−to−Ambient − Steady State (Note 2)
1. Limited by package to 50 A continuous.
2. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces.
R
37
q
Source
1
2
3
Gate Drain Source
2
Drain
A
Y
= Assembly Location*
= Year
WW
= Work Week
5862N = Device Code
G
= Pb−Free Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
January, 2015 − Rev. 4
NTD5862N/D