NTD5805N, NVD5805N
Power MOSFET
40 V, 51 A, Single N−Channel, DPAK
Features
• Low R
DS(on)
• High Current Capability
http://onsemi.com
• Avalanche Energy Specified
• NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
16 mW @ 5.0 V
9.5 mW @ 10 V
40 V
51 A
Applications
D
• LED Backlight Driver
• CCFL Backlight
• DC Motor Control
G
• Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
S
J
N−CHANNEL MOSFET
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
4
Gate−to−Source Voltage − Continuous
V
"20
"30
V
GS
GS
Gate−to−Source Voltage
V
V
2
1
− Non−Repetitive (t < 10 mS)
p
3
Continuous Drain
T
= 25°C
= 100°C
= 25°C
I
51
36
47
A
C
D
Current (R
(Note 1)
)
q
JC
CASE 369C
DPAK
(Surface Mount)
STYLE 2
Steady
State
T
C
Power Dissipation
(R ) (Note 1)
T
C
P
W
D
q
JC
Pulsed Drain Current
t = 10 ms
I
85
A
p
DM
MARKING DIAGRAM
& PIN ASSIGNMENT
Operating Junction and Storage Temperature
T , T
J
−55 to
175
°C
stg
Source Current (Body Diode)
I
30
80
A
S
4
Drain
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (V = 50 V, V = 10 V, R = 25 W,
DD
GS
G
I
= 40 A, L = 0.1 mH, V = 40 V)
L(pk)
DS
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
Drain
1
3
Gate Source
THERMAL RESISTANCE MAXIMUM RATINGS
Y
= Year
WW
= Work Week
Parameter
Symbol
Value
Unit
5805N = Device Code
= Pb−Free Package
Junction−to−Case (Drain)
R
3.2
°C/W
q
JC
G
Junction−to−Ambient − Steady State (Note 1)
R
107
q
JA
1. Surface−mounted on FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
April, 2012 − Rev. 4
NTD5805N/D