NTD5803N
Power MOSFET
40 V, 76 A, Single N−Channel, DPAK
Features
• Low R
DS(on)
• High Current Capability
• Avalanche Energy Specified
• These are Pb−Free Devices
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V
R
MAX
I MAX
D
(BR)DSS
DS(on)
Applications
10.1 mW @ 5.0 V
7.2 mW @ 10 V
54 A
76 A
40 V
• CCFL Backlight
• DC Motor Control
• Class D Amplifier
D
• Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
G
V
DSS
Gate−to−Source Voltage − Continuous
Gate−to−Source Voltage
V
"20
"30
V
GS
S
N−CHANNEL MOSFET
V
GS
V
− Non−Repetitive (t < 10 mS)
p
4
Continuous Drain
T
= 25°C
= 100°C
= 25°C
I
76
54
83
A
C
D
4
Current (R
(Note 1)
)
q
JC
Steady
State
T
C
2
1
Power Dissipation
(R ) (Note 1)
T
C
P
W
D
3
1
q
JC
2
3
DPAK
Pulsed Drain Current
t = 10 ms
I
228
A
p
DM
DPAK
CASE 369C
(Surface Mount)
STYLE 2
CASE 369D
(Straight Lead)
STYLE 2
Operating Junction and Storage Temperature
T , T
−55 to
175
°C
J
stg
Source Current (Body Diode)
I
76
A
S
Single Pulse Drain−to−Source Avalanche
E
240
mJ
AS
MARKING DIAGRAMS
& PIN ASSIGNMENT
Energy (V = 50 V, V = 10 V, R = 25 W,
DD
GS
G
I
= 40 A, L = 0.3 mH)
L(pk)
4
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
Drain
L
4
Drain
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
2
Drain
1
3
Parameter
Symbol
Value
Unit
Gate Source
1
2
3
Junction−to−Case (Drain)
R
1.8
64
°C/W
q
JC
Gate Drain Source
Junction−to−Ambient − Steady State (Note 1)
R
q
JA
Y
WW
= Year
= Work Week
5803N = Device Code
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces.
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
December, 2008 − Rev. 0
NTD5803N/D