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NTD5413NT4G PDF预览

NTD5413NT4G

更新时间: 2024-11-18 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
6页 104K
描述
Power MOSFET 30 Amps, 60 Volts Single N−Channel DPAK

NTD5413NT4G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:LEAD FREE, CASE 369AA-01, DPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.69Is Samacsys:N
雪崩能效等级(Eas):135 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):30 A最大漏极电流 (ID):30 A
最大漏源导通电阻:0.026 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):68 W最大脉冲漏极电流 (IDM):84 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTD5413NT4G 数据手册

 浏览型号NTD5413NT4G的Datasheet PDF文件第2页浏览型号NTD5413NT4G的Datasheet PDF文件第3页浏览型号NTD5413NT4G的Datasheet PDF文件第4页浏览型号NTD5413NT4G的Datasheet PDF文件第5页浏览型号NTD5413NT4G的Datasheet PDF文件第6页 
NTD5413N  
Power MOSFET  
30 Amps, 60 Volts Single NChannel  
DPAK  
Features  
Low R  
DS(on)  
http://onsemi.com  
High Current Capability  
Avalanche Energy Specified  
These are PbFree Devices  
I
D
MAX  
V
R
MAX  
DS(ON)  
(Note 1)  
(BR)DSS  
Applications  
60 V  
26 mW @ 10 V  
30 A  
LED Lighting and LED Backlight Drivers  
DCDC Converters  
DC Motor Drivers  
Switch Mode Power Supplies  
Power Supplies Secondary Side Synchronous Rectification  
NChannel  
D
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
G
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
S
GatetoSource Voltage Continuous  
GatetoSource Voltage Nonrepetitive  
V
$20  
$30  
V
GS  
V
GS  
V
(T < 10 ms)  
P
MARKING  
DIAGRAM  
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
30  
23  
68  
A
C
D
q
JC  
4
T
C
(Note 1)  
Drain  
Power Dissipation  
Steady  
State  
T
C
P
W
D
4
R
(Note 1)  
q
JC  
DPAK  
CASE 369AA  
STYLE 2  
Pulsed Drain Current  
t = 10 ms  
I
84  
A
p
DM  
2
1
Operating and Storage Temperature Range  
T , T  
J
55 to  
+175  
°C  
stg  
3
2
1
Gate  
3
Source Current (Body Diode)  
I
30  
A
S
Drain  
Source  
Single Pulse DraintoSource Avalanche  
E
AS  
135  
mJ  
Energy Starting T = 25°C  
J
(V = 50 V , V = 10 V, I = 30 A,  
L(pk)  
DD  
dc  
GS  
5413N = Device Code  
L = 0.3 mH, R = 25 W)  
G
Y
= Year  
Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
WW  
G
= Work Week  
= PbFree Device  
THERMAL RESISTANCE RATINGS  
Parameter  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Symbol  
Max  
2.2  
Unit  
JunctiontoCase (Drain) Steady State  
(Note 1)  
°C/W  
R
q
JC  
R
58.5  
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
(Cu Area 1.127 sq in [1 oz] including traces).  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
October, 2008 Rev. 0  
NTD5413N/D  
 

NTD5413NT4G 替代型号

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