NTB6410AN, NTP6410AN
N-Channel Power MOSFET
100 V, 76 A, 13 mW
Features
• Low R
DS(on)
• High Current Capability
• 100% Avalanche Tested
• These are Pb−Free Devices
http://onsemi.com
I
MAX
D
V
R
MAX
DS(ON)
(Note 1)
(BR)DSS
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)
J
100 V
13 mW @ 10 V
76 A
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Symbol
Value
100
$20
76
Unit
V
V
DSS
N−Channel
V
GS
V
D
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
D
A
C
q
JC
T
C
54
Power Dissipation
R
Steady
State
T
C
P
D
188
W
G
4
q
JC
Pulsed Drain Current
t = 10 ms
p
I
305
A
DM
S
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
S
76
A
4
Single Pulse Drain−to−Source Avalanche
E
AS
500
mJ
1
2
Energy (V = 50 Vdc, V = 10 Vdc,
DD
GS
I
= 57.7 A, L = 0.3 mH, R = 25 W)
L(pk)
G
3
Lead Temperature for Soldering
T
260
°C
L
2
TO−220AB
CASE 221A
STYLE 5
D PAK
Purposes, 1/8″ from Case for 10 Seconds
CASE 418B
STYLE 2
1
THERMAL RESISTANCE RATINGS
Parameter
2
3
Symbol
Max
0.8
32
Unit
MARKING DIAGRAM
& PIN ASSIGNMENT
Junction−to−Case (Drain) Steady State
Junction−to−Ambient (Note 1)
R
°C/W
q
JC
4
R
q
JA
4
Drain
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
Drain
NTB
6410ANG
AYWW
NTP
(Cu Area 1.127 sq in [2 oz] including traces).
6410ANG
AYWW
2
1
Gate
3
1
Gate
3
Drain
Source
Source
2
6410AN = Specific Device Code
Drain
G
A
Y
= Pb−Free Device
= Assembly Location
= Year
WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
December, 2009 − Rev. 0
NTB6410AN/D