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NTB6448ANT4G PDF预览

NTB6448ANT4G

更新时间: 2024-11-05 21:15:15
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲晶体管
页数 文件大小 规格书
7页 142K
描述
76A, 100V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 418B-04, D2PAK-3

NTB6448ANT4G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:LEAD FREE, CASE 418B-04, D2PAK-3
针数:3Reach Compliance Code:not_compliant
HTS代码:8541.29.00.95风险等级:5.83
雪崩能效等级(Eas):500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):76 A最大漏极电流 (ID):76 A
最大漏源导通电阻:0.013 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):188 W最大脉冲漏极电流 (IDM):305 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

NTB6448ANT4G 数据手册

 浏览型号NTB6448ANT4G的Datasheet PDF文件第2页浏览型号NTB6448ANT4G的Datasheet PDF文件第3页浏览型号NTB6448ANT4G的Datasheet PDF文件第4页浏览型号NTB6448ANT4G的Datasheet PDF文件第5页浏览型号NTB6448ANT4G的Datasheet PDF文件第6页浏览型号NTB6448ANT4G的Datasheet PDF文件第7页 
NTB6448AN, NTP6448AN  
N-Channel Power MOSFET  
100 V, 76 A, 13 mW  
Features  
Low R  
DS(on)  
High Current Capability  
100% Avalanche Tested  
These are PbFree Devices  
http://onsemi.com  
I
MAX  
D
V
R
MAX  
DS(ON)  
(Note 1)  
(BR)DSS  
MAXIMUM RATINGS (T = 25°C Unless otherwise specified)  
J
100 V  
13 mW @ 10 V  
76 A  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
100  
$20  
76  
Unit  
V
V
DSS  
NChannel  
V
GS  
V
D
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
A
C
q
JC  
T
C
54  
Power Dissipation  
R
Steady  
State  
T
C
P
D
188  
W
G
4
q
JC  
Pulsed Drain Current  
t = 10 ms  
p
I
305  
A
DM  
S
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
76  
A
4
Single Pulse DraintoSource Avalanche  
E
AS  
500  
mJ  
1
2
Energy (V = 50 Vdc, V = 10 Vdc,  
DD  
GS  
I
= 57.7 A, L = 0.3 mH, R = 25 W)  
L(pk)  
G
3
Lead Temperature for Soldering  
T
260  
°C  
L
2
TO220AB  
CASE 221A  
STYLE 5  
D PAK  
Purposes, 1/8from Case for 10 Seconds  
CASE 418B  
STYLE 2  
1
THERMAL RESISTANCE RATINGS  
Parameter  
2
3
Symbol  
Max  
0.8  
32  
Unit  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient (Note 1)  
R
°C/W  
q
JC  
4
R
q
JA  
4
Drain  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
Drain  
NTB  
6448ANG  
AYWW  
NTP  
(Cu Area 1.127 sq in [2 oz] including traces).  
6448ANG  
AYWW  
2
1
Gate  
3
1
Gate  
3
Drain  
Source  
Source  
2
6448AN = Specific Device Code  
Drain  
G
A
Y
= PbFree Device  
= Assembly Location  
= Year  
WW = Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
October, 2009 Rev. 0  
NTB6448AN/D  
 

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