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MRF176GV PDF预览

MRF176GV

更新时间: 2024-01-02 08:25:47
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摩托罗拉 - MOTOROLA 晶体射频场效应晶体管放大器局域网
页数 文件大小 规格书
10页 181K
描述
N-CHANNEL MOS BROADBAND RF POWER FETs

MRF176GV 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:CASE 375-04, 4 PIN
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:1.71
外壳连接:SOURCE配置:COMMON SOURCE, 2 ELEMENTS
最小漏源击穿电压:125 V最大漏极电流 (Abs) (ID):16 A
最大漏极电流 (ID):16 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:ULTRA HIGH FREQUENCY BANDJESD-30 代码:R-CDFM-F4
元件数量:2端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:200 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):400 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON

MRF176GV 数据手册

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Order this document  
by MRF176GU/D  
SEMICONDUCTOR TECHNICAL DATA  
The RF MOSFET Line  
N–Channel Enhancement–Mode  
Designed for broadband commercial and military applications using push pull  
circuits at frequencies to 500 MHz. The high power, high gain and broadband  
performance of these devices makes possible solid state transmitters for FM  
broadcast or TV channel frequency bands.  
200/150 W, 50 V, 500 MHz  
N–CHANNEL MOS  
BROADBAND  
Electrical Performance  
RF POWER FETs  
MRF176GU @ 50 V, 400 MHz (“U” Suffix)  
Output Power — 150 Watts  
Power Gain — 14 dB Typ  
Efficiency — 50% Typ  
MRF176GV @ 50 V, 225 MHz (“V” Suffix)  
Output Power — 200 Watts  
Power Gain — 17 dB Typ  
Efficiency — 55% Typ  
D
100% Ruggedness Tested At Rated Output Power  
Low Thermal Resistance  
G
G
Low C  
rss  
— 7.0 pF Typ @ V  
DS  
= 50 V  
S
(FLANGE)  
CASE 375–04, STYLE 2  
D
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
125  
±40  
16  
Unit  
Vdc  
Vdc  
Adc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
Drain Current — Continuous  
I
D
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
400  
2.27  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.44  
°C/W  
θJC  
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS (1)  
Drain–Source Breakdown Voltage  
(V = 0, I = 100 mA)  
V
125  
Vdc  
mAdc  
µAdc  
(BR)DSS  
GS  
Zero Gate Voltage Drain Current  
(V = 50 V, V = 0)  
D
I
2.5  
1.0  
DSS  
DS  
Gate–Body Leakage Current  
(V = 20 V, V = 0)  
GS  
I
GSS  
GS  
NOTE:  
1. Each side of device measured separately.  
DS  
REV 8  
Motorola, Inc. 1995  

MRF176GV 替代型号

型号 品牌 替代类型 描述 数据表
MRF151G MACOM

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