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MRF18030AR3 PDF预览

MRF18030AR3

更新时间: 2024-11-18 20:00:11
品牌 Logo 应用领域
恩智浦 - NXP 局域网放大器晶体管
页数 文件大小 规格书
8页 504K
描述
L BAND, Si, N-CHANNEL, RF POWER, MOSFET, NI-400, CASE 465E-04, 2 PIN

MRF18030AR3 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:NI-400, CASE 465E-04, 2 PIN针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.29.00.75风险等级:5.31
外壳连接:SOURCE配置:SINGLE
最小漏源击穿电压:65 VFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:L BANDJESD-30 代码:R-CDFM-F2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:200 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):83.3 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF18030AR3 数据手册

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MOTOROLA  
SEMICONDUCTOR TECHNICAL DATA  
Freescale Semiconductor, Inc.  
Order this document  
by MRF18030A/D  
The RF MOSFET Line  
RF Power Field Effect Transistors  
MRF18030ALR3  
N-Channel Enhancement-Mode Lateral MOSFETs MRF18030ALSR3  
Designed for GSM and EDGE base station applications with frequencies  
from 1.8 to 2.0 GHz. Suitable for FM, TDMA, CDMA and multicarrier amplifier  
applications. Specified for GSM 1805 - 1880 MHz.  
1.8 - 1.88 GHz, 30 W, 26 V  
GSM/GSM EDGE  
LATERAL N-CHANNEL  
RF POWER MOSFETs  
Typical GSM Performance:  
Power Gain - 14 dB (Typ) @ 30 Watts  
Efficiency - 50% (Typ) @ 30 Watts  
Internally Matched, Controlled Q, for Ease of Use  
High Gain, High Efficiency and High Linearity  
Integrated ESD Protection  
Designed for Maximum Gain and Insertion Phase Flatness  
Capable of Handling 5:1 VSWR, @ 26 Vdc, 30 W Output Power  
Excellent Thermal Stability  
CASE 465E-04, STYLE 1  
NI-400  
MRF18030ALR3  
Low Gold Plating Thickness on Leads, 40µ″ Nominal.  
in Tape and Reel. R3 Suffix = 250 Units per 32 mm, 13 inch Reel.  
CASE 465F-04, STYLE 1  
NI-400S  
MRF18030ALSR3  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Drain-Source Voltage  
Gate-Source Voltage  
V
DSS  
V
-0.5, +15  
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
83.3  
0.48  
Watts  
W/°C  
C
D
Storage Temperature Range  
Operating Junction Temperature  
T
- 65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
JC  
2.1  
°C/W  
ESD PROTECTION CHARACTERISTICS  
Test Conditions  
Class  
Human Body Model  
Machine Model  
2 (Minimum)  
M3 (Minimum)  
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
Rev. 6  
Motorola, Inc. 2004  
For More Information On This Product,  
Go to: www.freescale.com  
 

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