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MRF176GU PDF预览

MRF176GU

更新时间: 2024-11-04 22:22:15
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 晶体射频场效应晶体管放大器局域网
页数 文件大小 规格书
10页 181K
描述
N-CHANNEL MOS BROADBAND RF POWER FETs

MRF176GU 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-CDFM-F4
Reach Compliance Code:unknown风险等级:5.21
Is Samacsys:N外壳连接:SOURCE
配置:COMMON SOURCE, 2 ELEMENTS最小漏源击穿电压:125 V
最大漏极电流 (Abs) (ID):16 A最大漏极电流 (ID):16 A
最大漏源导通电阻:1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:ULTRA HIGH FREQUENCY BANDJESD-30 代码:R-CDFM-F4
元件数量:2端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:200 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:400 W最大功率耗散 (Abs):400 W
最小功率增益 (Gp):12 dB认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MRF176GU 数据手册

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Order this document  
by MRF176GU/D  
SEMICONDUCTOR TECHNICAL DATA  
The RF MOSFET Line  
N–Channel Enhancement–Mode  
Designed for broadband commercial and military applications using push pull  
circuits at frequencies to 500 MHz. The high power, high gain and broadband  
performance of these devices makes possible solid state transmitters for FM  
broadcast or TV channel frequency bands.  
200/150 W, 50 V, 500 MHz  
N–CHANNEL MOS  
BROADBAND  
Electrical Performance  
RF POWER FETs  
MRF176GU @ 50 V, 400 MHz (“U” Suffix)  
Output Power — 150 Watts  
Power Gain — 14 dB Typ  
Efficiency — 50% Typ  
MRF176GV @ 50 V, 225 MHz (“V” Suffix)  
Output Power — 200 Watts  
Power Gain — 17 dB Typ  
Efficiency — 55% Typ  
D
100% Ruggedness Tested At Rated Output Power  
Low Thermal Resistance  
G
G
Low C  
rss  
— 7.0 pF Typ @ V  
DS  
= 50 V  
S
(FLANGE)  
CASE 375–04, STYLE 2  
D
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
125  
±40  
16  
Unit  
Vdc  
Vdc  
Adc  
Drain–Source Voltage  
Gate–Source Voltage  
V
DSS  
V
GS  
Drain Current — Continuous  
I
D
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
400  
2.27  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
THERMAL CHARACTERISTICS  
T
65 to +150  
200  
°C  
°C  
stg  
T
J
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.44  
°C/W  
θJC  
Handling and Packaging — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS (1)  
Drain–Source Breakdown Voltage  
(V = 0, I = 100 mA)  
V
125  
Vdc  
mAdc  
µAdc  
(BR)DSS  
GS  
Zero Gate Voltage Drain Current  
(V = 50 V, V = 0)  
D
I
2.5  
1.0  
DSS  
DS  
Gate–Body Leakage Current  
(V = 20 V, V = 0)  
GS  
I
GSS  
GS  
NOTE:  
1. Each side of device measured separately.  
DS  
REV 8  
Motorola, Inc. 1995  

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