MMDTA42
Lead-free Green
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
A
·
·
·
·
Epitaxial Planar Die Construction
SOT-26
Ideal for Medium Power Amplification and Switching
Dim Min Max Typ
Lead Free/RoHS Compliant (Note 3)
"Green" Device, Note 4 and 5
A
B
C
D
F
0.35 0.50 0.38
1.50 1.70 1.60
2.70 3.00 2.80
C
B
Mechanical Data
¾
¾
0.95
0.55
H
·
Case: SOT-26
¾
¾
·
Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
K
M
H
J
2.90 3.10 3.00
0.013 0.10 0.05
1.00 1.30 1.10
0.35 0.55 0.40
0.10 0.20 0.15
J
F
L
D
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: See Diagram
K
L
Terminals: Finish - Matte Tin Solderable per
MIL-STD-202, Method 208
M
a
Q2
0°
8°
¾
·
Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
Q1
All Dimensions in mm
·
·
·
Marking (See Page 2): K3M
Ordering & Date Code Information: See Page 2
Weight: 0.008 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VCBO
VCEO
VEBO
IC
Value
300
300
6.0
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
V
Emitter-Base Voltage
V
Collector Current (Note 1) (Note 2)
Power Dissipation (Note 1)
500
300
417
mA
mW
°C/W
°C
Pd
R
qJA
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage and Temperature Range
Tj, TSTG
-55 to +150
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. When operated under collector-emitter saturation conditions within the safe operating area defined by the thermal resistance rating (R ), power
qJA
dissipation rating (P ) and power derating curve (figure 1).
d
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.
5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30438 Rev. 4 - 2
1 of 4
MMDTA42
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ã Diodes Incorporated