MMDF1300
Power MOSFET
3 Amps, 25 Volts
Complementary SO–8, Dual
These miniature surface mount MOSFETs feature ultra low R
DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain–to–source diode has a very low reverse recovery time.
MiniMOSt devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dc–dc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls
in mass storage products such as disk drives and tape drives. The
avalanche energy is specified to eliminate the guesswork in designs
where inductive loads are switched and offer additional safety margin
against unexpected voltage transients.
http://onsemi.com
3 AMPERES
25 VOLTS
= 100 mW (N–Channel)
= 210 mW (P–Channel)
R
R
DS(on)
DS(on)
N–Channel
P–Channel
D
D
• Low R
DS(on)
Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive – Can be Driven by Logic ICs
• Miniature SO–8 Surface Mount Package – Saves Board Space
• Diode Exhibits High Speed, with Soft Recovery
G
G
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
MARKING
DIAGRAM
Rating
Drain–to–Source Voltage
Gate–to–Source Voltage
Symbol Value
Unit
Vdc
Vdc
Adc
V
DSS
25
V
GS
± 20
Drain Current – Continuous
N–Channel
I
D
SO–8, Dual
CASE 751
STYLE 11
1300
LYWW
3.0
2.0
8
P–Channel
Drain Current – Pulsed
N–Channel
I
Apk
DM
1
9.0
6.0
P–Channel
1300
L
Y
= Device Code
= Location Code
= Year
Operating and Storage Temperature Range
T , T
J stg
–65 to
+150
°C
WW
= Work Week
Total Power Dissipation @ T = 25°C
P
1.8
Watts
mJ
A
D
Single Pulse Drain–to–Source Avalanche
E
AS
PIN ASSIGNMENT
Energy – Starting T = 25°C
J
(V
= 20 Vdc, V
= 10 Vdc,
113
66.3
260
DD
GS
= 3.0 Apk, L = 25 mH, R = 25 W)
Source–1
Gate–1
Drain–1
Drain–1
Drain–2
1
2
3
4
8
7
6
5
I
L
G
Thermal Resistance – Junction–to–Ambient
(Note 1.)
R
°C/W
°C
θJA
Source–2
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 sec.
T
L
Gate–2
Drain–2
Top View
1. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided),
10 sec. max.
ORDERING INFORMATION
Device
MMDF1300R2
Package
Shipping
2500 Tape & Reel
SO–8
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 1
MMDF1300/D