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MMDF1300 PDF预览

MMDF1300

更新时间: 2024-11-17 22:30:03
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 47K
描述
Power MOSFET 3 Amps, 25 Volts

MMDF1300 数据手册

 浏览型号MMDF1300的Datasheet PDF文件第2页浏览型号MMDF1300的Datasheet PDF文件第3页浏览型号MMDF1300的Datasheet PDF文件第4页 
MMDF1300  
Power MOSFET  
3 Amps, 25 Volts  
Complementary SO–8, Dual  
These miniature surface mount MOSFETs feature ultra low R  
DS(on)  
and true logic level performance. They are capable of withstanding  
high energy in the avalanche and commutation modes and the  
drain–to–source diode has a very low reverse recovery time.  
MiniMOSt devices are designed for use in low voltage, high speed  
switching applications where power efficiency is important. Typical  
applications are dc–dc converters, and power management in portable  
and battery powered products such as computers, printers, cellular and  
cordless phones. They can also be used for low voltage motor controls  
in mass storage products such as disk drives and tape drives. The  
avalanche energy is specified to eliminate the guesswork in designs  
where inductive loads are switched and offer additional safety margin  
against unexpected voltage transients.  
http://onsemi.com  
3 AMPERES  
25 VOLTS  
= 100 mW (N–Channel)  
= 210 mW (P–Channel)  
R
R
DS(on)  
DS(on)  
N–Channel  
P–Channel  
D
D
Low R  
DS(on)  
Provides Higher Efficiency and Extends Battery Life  
Logic Level Gate Drive – Can be Driven by Logic ICs  
Miniature SO–8 Surface Mount Package – Saves Board Space  
Diode Exhibits High Speed, with Soft Recovery  
G
G
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
MARKING  
DIAGRAM  
Rating  
Drain–to–Source Voltage  
Gate–to–Source Voltage  
Symbol Value  
Unit  
Vdc  
Vdc  
Adc  
V
DSS  
25  
V
GS  
± 20  
Drain Current – Continuous  
N–Channel  
I
D
SO–8, Dual  
CASE 751  
STYLE 11  
1300  
LYWW  
3.0  
2.0  
8
P–Channel  
Drain Current – Pulsed  
N–Channel  
I
Apk  
DM  
1
9.0  
6.0  
P–Channel  
1300  
L
Y
= Device Code  
= Location Code  
= Year  
Operating and Storage Temperature Range  
T , T  
J stg  
–65 to  
+150  
°C  
WW  
= Work Week  
Total Power Dissipation @ T = 25°C  
P
1.8  
Watts  
mJ  
A
D
Single Pulse Drain–to–Source Avalanche  
E
AS  
PIN ASSIGNMENT  
Energy – Starting T = 25°C  
J
(V  
= 20 Vdc, V  
= 10 Vdc,  
113  
66.3  
260  
DD  
GS  
= 3.0 Apk, L = 25 mH, R = 25 W)  
Source–1  
Gate–1  
Drain–1  
Drain–1  
Drain–2  
1
2
3
4
8
7
6
5
I
L
G
Thermal Resistance – Junction–to–Ambient  
(Note 1.)  
R
°C/W  
°C  
θJA  
Source–2  
Maximum Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 sec.  
T
L
Gate–2  
Drain–2  
Top View  
1. Mounted on 2square FR4 board (1sq. 2 oz. Cu 0.06thick single sided),  
10 sec. max.  
ORDERING INFORMATION  
Device  
MMDF1300R2  
Package  
Shipping  
2500 Tape & Reel  
SO–8  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
March, 2001 – Rev. 1  
MMDF1300/D  

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